Guide a HBM product through concept, design, NPI and HVM by facilitating cross-functional life-cycle management.
Provide leadership and direction for the Product Development Team (PDT) by defining and prioritizing projects, identifying and analyzing issues and risk, and identifying resources to meet timelines and deliverables.
Build and maintain detailed development schedule and drive relevant tactical execution starting from pre-silicon to all the way to HVM.
Integrate all aspects of HBM development within the extended HIG and TPG teams and with partner organizations.
Partner with the Technology Development, Design, Process, APTD, PE and Manufacturing teams to drive development progress and alignment.
Collaborate with PMO org to build and maintain detailed development schedule and drive relevant tactical execution.
Provide regular communication of development status, priorities, and challenges across the broader organization.
Set and prioritize tactical expectations across development activities, according to defined milestones and stakeholder needs and expectations.
Serve as a point of contact for the product, including identifying owners for tasks and issues that require coverage and managing development documentation.
Consolidate and provide the inputs for hardware readiness and capacity planning required to support engineering activities.
Requirements
Bachelor’s or Master’s degree in Electrical or Computer Engineering or manufacturing/supply chain related fields.
5+ years of relevant Semiconductor Process integration, Product development technical or advance packaging manufacturing experience and track record of driving cross functional teams meet deliverable goals.
Excellent Communication/Presentation skills.
Excellent written and verbal communication skills for technical and senior management audiences.
Comfortable with data analysis methods and data visualization; communicating data-backed conclusions.
Familiarity and capability with JIRA, Confluence, Project Management software tools.
Having an innovative mindset which is open to improve upon any process or product.
ATS Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard skills
Semiconductor Process integrationProduct developmentAdvanced packaging manufacturingData analysis methodsData visualization
Bachelor’s degree in Electrical EngineeringBachelor’s degree in Computer EngineeringMaster’s degree in Electrical EngineeringMaster’s degree in Computer Engineering