Process Integration Engineer
Applied Materials
full-time
Posted on:
Location Type: Hybrid
Location: Albany • California • New York • United States
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Salary
💰 $176,000 - $242,000 per year
About the role
- Developing new modules leveraging Applied’s wide equipment portfolio
- Advising on equipment requirements for Advanced semiconductor packaging
- Acting as engineering expert in semiconductor packaging
- Driving cross functional projects
Requirements
- Minimum of BS/MS in Electrical, Mechanical Engineering, Material Engineering or equivalent
- 10 years of experience in semiconductor packaging development and manufacturing
- Strong communication skills
- Ability to drive new materials and process development
- Domain expertise in advanced packaging areas
Benefits
- Supportive work culture
- Health and wellbeing programs
- Professional growth opportunities
- Potential bonuses and stock options
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills & Tools
semiconductor packaging developmentmaterials developmentprocess developmentengineering expertise
Soft Skills
strong communication skillscross-functional project management
Certifications
BS in Electrical EngineeringMS in Electrical EngineeringBS in Mechanical EngineeringMS in Mechanical EngineeringBS in Material EngineeringMS in Material Engineering