Advanced Packaging Integration Engineer
Applied Materials
full-time
Posted on:
Location Type: Office
Location: Albany • California • New York • United States
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Salary
💰 $128,000 - $176,000 per year
About the role
- play a crucial role in designing and optimizing manufacturing processes for display and semiconductor manufacturing technologies
- collect and analyze data, perform hardware characterization, and troubleshoot engineering issues
- measure film properties, generate technical documentation, and engage with customers to resolve concerns
- collaborate with vendors and suppliers, and become familiar with implementing new technologies and products
- experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries
Requirements
- Minimum of BS/MS in Electrical, Mechanical Engineering, Material Engineering or equivalent
- 3 years of experience in advanced packaging specializing in logic, DRAM or NAND
- Experience with MES systems for Si fab processing is a plus
- Strong communication skills to be effective in dealing with business units, cross-functional teams, internal or external customers
- Lead projects across organization and culture in a fast-paced environment
- Self-starter, team player and able to work independently with minimal supervision
Benefits
- supportive work culture that encourages you to learn, develop, and grow your career
- programs and support that encourage personal and professional growth
- care for you at work, at home, or wherever you may go
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills & Tools
manufacturing processeshardware characterizationdata analysisfilm properties measurementtechnical documentationadvanced packagingSi fab processing
Soft Skills
strong communicationteam playerself-starterproject leadershipcollaboration
Certifications
BS in Electrical EngineeringMS in Electrical EngineeringBS in Mechanical EngineeringMS in Mechanical EngineeringBS in Material EngineeringMS in Material Engineering