Director, Heterogenous Integration – Advance Packaging
Applied Materials
full-time
Posted on:
Location Type: Office
Location: Santa Clara • California • New York • United States
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Salary
💰 $180,000 - $247,500 per year
Job Level
About the role
- Develop new modules in Advanced Semiconductor Packaging
- Drive new materials and process development
- Define and develop differentiated modules by leveraging Applied’s tools
Requirements
- Minimum of BS/MS in Electrical, Mechanical Engineering, Material Engineering or equivalent
- 5 years of experience in advanced packaging specializing in logic, DRAM or NAND
- Experience with MES systems for Si fab processing is a plus
Benefits
- Supportive work culture
- Professional growth programs
- Health and wellbeing support
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills & Tools
Advanced Semiconductor Packagingmaterials developmentprocess developmentSi fab processinglogic packagingDRAM packagingNAND packaging
Certifications
BS in Electrical EngineeringMS in Electrical EngineeringBS in Mechanical EngineeringMS in Mechanical EngineeringBS in Material EngineeringMS in Material Engineering