Own the product strategy and roadmap for TIE’s advanced 2.5D/3D microsystems integration platforms
Author and maintain comprehensive Product Requirements Documents (PRDs)
Drive cross-functional collaboration across internal teams
Engage closely with customers and industry partners
Serve as a technical champion for 2.5D/3D integration
Develop and execute detailed program plans covering scope, schedules, risk mitigation, resource allocation, and customer communication
Create technical documentation and collateral that support customer design teams
Monitor advanced packaging market trends and competitive developments
Champion a culture of accountability and transparency across all product workstreams
Requirements
BS in Electrical Engineering, Computer Engineering, or a related technical discipline
Senior Product Manager: 5+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development
Principal Product Manager: 10+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development
Proven expertise in advanced packaging technologies (e.g. 2.5D interposers, through-silicon vias, wafer-level packaging, 3D stacking, RDL/interposer technologies) and heterogeneous integration techniques
Working knowledge of semiconductor fabrication processes and electronic design automation (EDA) flows for PDK/ADK creation
Exceptional communication skills
Startup DNA
Execution mindset
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.