The College of Education at The University of Texas at Austin

Senior Product Manager

The College of Education at The University of Texas at Austin

full-time

Posted on:

Location Type: Hybrid

Location: Austin • Texas • 🇺🇸 United States

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Job Level

Senior

About the role

  • Own the product strategy and roadmap for TIE’s advanced 2.5D/3D microsystems integration platforms
  • Author and maintain comprehensive Product Requirements Documents (PRDs)
  • Drive cross-functional collaboration across internal teams
  • Engage closely with customers and industry partners
  • Serve as a technical champion for 2.5D/3D integration
  • Develop and execute detailed program plans covering scope, schedules, risk mitigation, resource allocation, and customer communication
  • Create technical documentation and collateral that support customer design teams
  • Monitor advanced packaging market trends and competitive developments
  • Champion a culture of accountability and transparency across all product workstreams

Requirements

  • BS in Electrical Engineering, Computer Engineering, or a related technical discipline
  • Senior Product Manager: 5+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development
  • Principal Product Manager: 10+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development
  • Proven expertise in advanced packaging technologies (e.g. 2.5D interposers, through-silicon vias, wafer-level packaging, 3D stacking, RDL/interposer technologies) and heterogeneous integration techniques
  • Working knowledge of semiconductor fabrication processes and electronic design automation (EDA) flows for PDK/ADK creation
  • Exceptional communication skills
  • Startup DNA
  • Execution mindset

Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard skills
semiconductor packagingmicrosystems integrationadvanced packaging technologies2.5D interposersthrough-silicon viaswafer-level packaging3D stackingRDL/interposer technologiessemiconductor fabrication processeselectronic design automation
Soft skills
communication skillscross-functional collaborationaccountabilitytransparencyexecution mindset
Certifications
BS in Electrical EngineeringBS in Computer Engineering
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