Senior Quality Engineer
RTX
AssemblyCyber Security
Senior Principal Electronics Packaging Engineer
RTX
full-time
Posted on:
Origin: • 🇺🇸 United States
Visit company websiteSalary
💰 $124,000 - $250,000 per year
Job Level
Senior
Tech Stack
AssemblyCyber Security
About the role
- Investigate Circuit Card Assembly (CCA) production failures and support development of new radiation-hardened CCA designs for military space applications
- Engineer unique packaging, fixturing, and tooling solutions, deliver development hardware, facilitate delivery of production hardware, and process engineering changes to production configuration
- Work with other disciplines to root cause CCA test failures including process, thermal analysis, structural analysis, and electrical design
- Participate in and lead investigations into complex, open-ended issues to identify root causes of non-conforming hardware
- Identify and interface with Customer stakeholders and vendors regularly
- Create and present non-conformance reports to the Customer, provide recommendations for disposition, define/create repair procedures and work instructions as required
- Lead design and development of complex electronics packaging solutions with minimal oversight
- Create part models and drawings for CCA-level packaging, fixturing, and tooling
- Work with vendors to support process and product quality improvements
- Interface with cross functional teams (Electrical, Systems engineering) to deliver development and production hardware meeting requirements
- Communicate technical topics to both technical and non-technical team members and provide feedback during peer reviews
- Mentor and document knowledge to provide technical guidance to team members and beyond
Requirements
- Bachelors degree in Science, Technology, Engineering or Mathematics (STEM) and minimum 10 years prior relevant experience
- Ability to obtain and maintain a U.S. government issued security clearance
- U.S. citizenship required
- Experience with direct external customer interface at the senior engineering level
- Experience with 3D CAD software (Creo, SolidWorks, or similar)
- Experience with project management
- At least 10 years of experience on one or more DoD programs delivering mission-assured, hostile radiation survivable components, subsystems, and/or systems for space (preferred)
- Excellent written and verbal communication skills
- Practical experience in design and thermal management techniques for electronics packaging designs with rigorous size, weight, and power (SWaP) requirements
- Hands-on experience designing to meet and qualifying products for rugged environments such as those with electromagnetic interference (EMI), electromagnetic pulse (EMP), and nuclear exposure
- Experience with schematic capture tools (Expedition, etc.)
- Working experience with thermal/structural analysis of CCAs, PWBs, and frames
- Direct experience with printed circuit board (PCB) designs
- Can support tasks not directly mechanical such as component selection and layout
- Experience with rapid prototyping process methods, such as 3D printing
