Lead and execute STA closure for complex SoC designs, ensuring all timing constraints are met across multiple corners and modes.
Perform comprehensive Signal Integrity (SI) and Power Integrity (PI) analysis to identify and resolve timing issues caused by signal coupling, IR drop, and ground bounce.
Develop and implement chip finishing strategies, including ECO flows (Engineering Change Orders), to ensure designs are ready for tape-out.
Drive Design for Manufacturing (DFM) initiatives by collaborating with the design and foundry teams to optimize the physical layout for manufacturability and yield.
Work closely with the physical design (PD) team to provide guidance on timing-driven placement and routing.
Develop and improve STA methodologies, scripts, and flows to increase efficiency and accuracy.
Effectively communicate technical challenges, progress, and solutions to cross-functional teams and management.
Lead and mentor junior engineers.
Requirements
Bachelor's or master's degree in electrical engineering, Computer Engineering, or a related field.
5+ years of experience in STA closure for complex digital designs.
Proven expertise in Signal Integrity (SI) and Power Integrity (PI) analysis, including understanding of crosstalk and IR drop effects.
Solid knowledge of chip finishing methodologies, including timing sign-off and tape-out readiness checks.
Familiarity with Design for Manufacturing (DFM) principles and their application in physical design.
Experience with industry-standard EDA tools for STA (e.g., PrimeTime, Tempus).
Strong understanding of physical design (PD) concepts, including floorplanning, placement, and routing.
Excellent problem-solving, analytical, and debugging skills.
Strong verbal and written communication skills with the ability to lead technical discussions and present complex information clearly.
Experience with scripting languages (Tcl, Python, Perl) is a must.
Experience with management skills like project planning, scheduling, and resource allocation is a plus.