Responsible for design, development, and sustainment of advanced electronic systems integrating smart antennas, automotive Ethernet, radar, lidar, and camera interfaces.
Develop ruggedized compute platforms capable of running AI algorithms for environmental awareness and vehicle control in extreme conditions.
Design high-speed, high-reliability PCBs for sensor fusion and compute platforms.
Integrate wireless communication modules (LTE, 5G, ISM, GNSS, Wi-Fi) and automotive Ethernet PHYs.
Architect power distribution and thermal management strategies for compute-heavy systems.
Interface with radar, lidar, and camera modules using automotive-grade protocols (GMSL, FPD-Link, CAN, Ethernet).
Ensure signal integrity and EMI/EMC compliance in mixed-signal environments.
Design for IP67 ingress protection, extended temperature ranges (-40°C to +85°C), and high-vibration environments; support ISO 16750, CISPR 25, AEC-Q100 testing.
Lead root cause analysis, validation (HIL, thermal cycling, vibration), and support manufacturing with DFM/DFT practices.
Collaborate with mechanical, software, and systems engineers from concept through production.
Requirements
Bachelor’s or Master’s in Electrical or Computer Engineering.
5+ years of experience in embedded hardware design, preferably in automotive or rugged environments.
Proficiency in Altium Designer or equivalent ECAD tools.
Experience with RF design, high-speed digital design, and power electronics.
Familiarity with AI/ML hardware accelerators (e.g., NVIDIA Jetson, TI Jacinto) is a plus.
Able to work in a collaborative, multi-site, team environment.
Confident self-starter.
Detail-oriented and able to follow complex instructions with a “first-time right” attitude.