Nokia

Optical Packaging Engineer

Nokia

full-time

Posted on:

Origin:  • 🇺🇸 United States • California, New York

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Salary

💰 $105,488 - $258,670 per year

Job Level

JuniorMid-Level

Tech Stack

AssemblyCloud

About the role

  • Lead next generation optical package design in collaboration with cross-functional teams, stakeholders and vendors to ensure package requirements are met
  • Own all the development of all the optical coupling activities and designs: fiber pigtail, lens coupling, free space optics, etc.
  • Optimize the optical coupling efficiency of optical engines and apply Design for Manufacturing principles to meet production volumes and cost targets
  • Survey advanced optical coupling solutions, materials and vendors to stay current with new technological advancements
  • Own and maintain the process and the manufacturing documentation, along with Bill of Materials for new products
  • Drive package debug activities during product validation and qualification
  • Support the development activities at our Contract Manufacturers, both remotely and on-site to ensure a smooth transition to mass production

Requirements

  • 2-4 years of experience
  • Experience in high-speed electronics package design and laser package design
  • Experience with optical coupling, fiber pigtail attachment, free space optics
  • Experience in microelectronics, optoelectronics packaging design and assembly
  • Knowledgeable in packaging technologies and processes, with glass/ceramic/metal material properties and multilayer materials interfaces after bonding
  • Experience with documentation of fabrication, inspection, and assembly processes
  • Solid interpersonal, communication and problem-solving skills to interact with engineering staff, external vendors and contractors effectively
  • Experience with package and process design/development from design to production
  • (Nice to have) Knowledge in materials property and process, yield analysis and enhancement, failure mode and analysis, quality tools such as DOE, SPC, and Six-Sigma
  • (Nice to have) Familiarity with Industry Test Standards such as JEDEC, EIA, Telcordia, Mil-Std
  • (Nice to have) Expertise in high-volume packaging of 2.5/3D packages
  • (Nice to have) Familiar with flipchip, BGA, PCBA, Flex design reliability and processing
  • (Nice to have) Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging