Salary
💰 $185,000 - $225,000 per year
About the role
- Design and implement packaging solutions for micro-optic assemblies of Si photonic and III-V dies at outsourced semiconductor assembly and test vendors
- Deep knowledge in photonic packaging design, simulation, optimization, assembly and testing
- Develop and implement novel photonic assembly and packaging
- Optimize assemblies for manufacturability and reliability
- Contribute to system-level optimization and product strategy
- Work in a small dynamic team environment and solve challenging problems to scale solutions
Requirements
- M.S. in Electrical Engineering, Applied Physics or related field
- Five (5) or more years relevant industry experience with demonstrated achievements in photonic packaging
- Experience with optical simulation software (Zemax, Lumerical, Flexcompute or equivalent)
- Experience with thermo-mechanical simulations (Ansys, Altair, Siemens, or equivalent)
- Experience with optimization of packaging towards manufacturability and reliability
- Experience working with outsourced semiconductor assembly and test vendors
- Experience with failure analysis, parts inspection and testing
- Ph.D. in Electrical Engineering, Materials Science, Applied Physics or related field (preferred)
- Experience with microelectronic assembly processes such as 3D and 2.5D assemblies (preferred)
- Excellent communication and presentation skills (writing and delivering presentations), can work with senior external partners with ease (preferred)
- Hands-on experience in advancing product from prototype to final production stage (preferred)