Intel Corporation

Account Technical Solutions Engineer, Foundry Services Advanced Packaging

Intel Corporation

full-time

Posted on:

Location Type: Office

Location: PhoenixArizonaCaliforniaUnited States

Visit company website

Explore more

AI Apply
Apply

Salary

💰 $220,320 - $311,040 per year

Job Level

Tech Stack

About the role

  • Own the end-to-end customer relationship as the primary interface between the customer and Intel, ensuring seamless communication, trust, and alignment across all phases of engagement.
  • Work directly with customer to understand packaging challenges and requirements and provide technical consultation on packaging solutions and processes.
  • Engage expert stakeholders across Intel Foundry to ensure customers have firsthand access to information.
  • Collaborate with cross-functional teams including Technology Development, Product Engineering, Manufacturing and Operations, and Customer Engineering teams providing feedback to influence product and technology roadmaps.
  • Lead and coordinate all internal Intel interactions related to the customer account to drive commitment to execution across schedule, quality, technical execution, qualification and volume ramp.
  • Develop and maintain the Statement of Work (SOW) documenting customer requirements, Intel Foundry commitments, technical deliverables, and schedule milestones.
  • Manage full customer engagement lifecycle from initial design award through development, ramp, high volume manufacturing (HVM), and end of life.
  • Track and drive closure of customer commitment, action items and escalations.
  • Monitor milestones, risks, dependencies and change requests.
  • Drive resolution of issues affecting qualification and delivery.
  • Provide clear status reports to both customers and leadership.
  • Serve as the Voice of the Customer inside Intel Foundry, ensuring customer priorities, risks, and expectations are clearly communicated and advocated across all internal functions.

Requirements

  • Bachelors or Masters Degree in Electrical Engineering, Materials Science, Mechanical Engineering or Chemical Engineering or related field.
  • 10+ years industry experience
  • 5+ years in Semiconductor Packaging, Assembly / Test or Backend Manufacturing, Operations, Product Engineering, Field Applications or customer-facing engineering.
Benefits
  • competitive pay
  • stock bonuses
  • benefit programs which include health
  • retirement
  • vacation
Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools
packaging solutionstechnical consultationcustomer engagement lifecyclehigh volume manufacturingrisk managementissue resolutionstatement of work documentationschedule managementtechnical executionqualifications
Soft Skills
communicationcollaborationleadershipcustomer relationship managementtrust buildinginfluencingadvocacyproblem-solvingstakeholder engagementstatus reporting
Certifications
Bachelors DegreeMasters Degree