
Account Technical Solutions Engineer, Foundry Services Advanced Packaging
Intel Corporation
full-time
Posted on:
Location Type: Office
Location: Phoenix • Arizona • California • United States
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Salary
💰 $220,320 - $311,040 per year
Tech Stack
About the role
- Own the end-to-end customer relationship as the primary interface between the customer and Intel, ensuring seamless communication, trust, and alignment across all phases of engagement.
- Work directly with customer to understand packaging challenges and requirements and provide technical consultation on packaging solutions and processes.
- Engage expert stakeholders across Intel Foundry to ensure customers have firsthand access to information.
- Collaborate with cross-functional teams including Technology Development, Product Engineering, Manufacturing and Operations, and Customer Engineering teams providing feedback to influence product and technology roadmaps.
- Lead and coordinate all internal Intel interactions related to the customer account to drive commitment to execution across schedule, quality, technical execution, qualification and volume ramp.
- Develop and maintain the Statement of Work (SOW) documenting customer requirements, Intel Foundry commitments, technical deliverables, and schedule milestones.
- Manage full customer engagement lifecycle from initial design award through development, ramp, high volume manufacturing (HVM), and end of life.
- Track and drive closure of customer commitment, action items and escalations.
- Monitor milestones, risks, dependencies and change requests.
- Drive resolution of issues affecting qualification and delivery.
- Provide clear status reports to both customers and leadership.
- Serve as the Voice of the Customer inside Intel Foundry, ensuring customer priorities, risks, and expectations are clearly communicated and advocated across all internal functions.
Requirements
- Bachelors or Masters Degree in Electrical Engineering, Materials Science, Mechanical Engineering or Chemical Engineering or related field.
- 10+ years industry experience
- 5+ years in Semiconductor Packaging, Assembly / Test or Backend Manufacturing, Operations, Product Engineering, Field Applications or customer-facing engineering.
Benefits
- competitive pay
- stock bonuses
- benefit programs which include health
- retirement
- vacation
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills & Tools
packaging solutionstechnical consultationcustomer engagement lifecyclehigh volume manufacturingrisk managementissue resolutionstatement of work documentationschedule managementtechnical executionqualifications
Soft Skills
communicationcollaborationleadershipcustomer relationship managementtrust buildinginfluencingadvocacyproblem-solvingstakeholder engagementstatus reporting
Certifications
Bachelors DegreeMasters Degree