Account Technical Solutions Engineer, Foundry Services Advanced Packaging

Intel Corporation

Technical Solutions Engineer at Intel focusing on semiconductor packaging and customer engagement. Collaborating with cross-functional teams to solve packaging challenges and deliver technology solutions.

Posted 4/15/2026full-timePhoenix • Arizona, California, Oregon, Texas • 🇺🇸 United StatesSeniorLead💰 $220,320 - $311,040 per yearWebsite

Tech Stack

Tools & technologies

Assembly

About the role

Key responsibilities & impact

Own the end-to-end customer relationship as the primary interface between the customer and Intel, ensuring seamless communication, trust, and alignment across all phases of engagement.
Work directly with customer to understand packaging challenges and requirements and provide technical consultation on packaging solutions and processes.
Engage expert stakeholders across Intel Foundry to ensure customers have firsthand access to information.
Collaborate with cross-functional teams including Technology Development, Product Engineering, Manufacturing and Operations, and Customer Engineering teams providing feedback to influence product and technology roadmaps.
Lead and coordinate all internal Intel interactions related to the customer account to drive commitment to execution across schedule, quality, technical execution, qualification and volume ramp.
Develop and maintain the Statement of Work (SOW) documenting customer requirements, Intel Foundry commitments, technical deliverables, and schedule milestones.
Manage full customer engagement lifecycle from initial design award through development, ramp, high volume manufacturing (HVM), and end of life.
Track and drive closure of customer commitment, action items and escalations.
Monitor milestones, risks, dependencies and change requests.
Drive resolution of issues affecting qualification and delivery.
Provide clear status reports to both customers and leadership.
Serve as the Voice of the Customer inside Intel Foundry, ensuring customer priorities, risks, and expectations are clearly communicated and advocated across all internal functions.

Requirements

What you’ll need

Bachelors or Masters Degree in Electrical Engineering, Materials Science, Mechanical Engineering or Chemical Engineering or related field.
10+ years industry experience
5+ years in Semiconductor Packaging, Assembly / Test or Backend Manufacturing, Operations, Product Engineering, Field Applications or customer-facing engineering.

Benefits

Comp & perks

competitive pay
stock bonuses
benefit programs which include health
retirement
vacation

ATS Keywords

✓ Tailor your resume

Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools

packaging solutionstechnical consultationcustomer engagement lifecyclehigh volume manufacturingrisk managementissue resolutionstatement of work documentationschedule managementtechnical executionqualifications

Soft Skills

communicationcollaborationleadershipcustomer relationship managementtrust buildinginfluencingadvocacyproblem-solvingstakeholder engagementstatus reporting

Certifications

Bachelors DegreeMasters Degree