Responsible for HBM project electric yield calculation for routing review and automation script development
Utilize statistical tools for detailed data analysis for electric yield improvement projects
Work with the wafer fab process/integration group to address process-related defects affecting electric yield
Work closely with probe and test related groups
Use project management skills to ensure timely completion of projects
Own the assembly portion of the product manufacturing process flow during development of new product introduction (NPI) in MTB
Work closely in conjunction with the APTD process team to set-up experiments using DOE, monitor progress of changes, and perform statistical analysis of results
Publish module updates, key project status updates, best known methods, and lessons learned
Requirements
Masters or Bachelor’s degree in Engineering
Strong logical thinking, as applied to general programming and problem solving
English skills and ability to work in a multi-national multi-functional team
Semiconductor manufacturing process (Front-end wafer process / Wafer Probe / Back-end assembly process / Back-end Test)
Skills and proficiency in statistical analysis/method like JMP/Mini-Tab/Yield3 analytic tools
Proficiency in critical computer applications like Excel, Word, Power Point
Python or Excel macro familiarity or experience
Strong written and verbal communication skills
3 years working experience in semiconductor industry (listed as a major skill/bonus)