Develop and optimize backgrind, bond, debond, and amine clean processes to meet performance and yield targets
Establish process parameters for GaAs and InP substrates; monitor equipment performance and implement corrective actions
Collaborate with integration engineering to transfer new processes into production
Develop and maintain in-line and offline metrology techniques; use associated metrology tools; monitor SPC and drive corrective actions
Serve as technical expert for backgrind, bond and debond processing; lead troubleshooting and partner with vendors and maintenance to improve tool performance
Conduct failure analysis and defect characterization; implement process improvements to enhance yield and drive continuous improvement
Develop and maintain process documentation (work instructions, FMEA, control plans); train technicians and junior engineers
Requirements
5+ years experience in semiconductor process engineering with focus on backgrind, bond and debond
Experience with GaAs and InP substrates preferred
BS/MS degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics or related field
Hands-on experience with standard backgrind, bond and debond to sapphires, amine clean
Strong background in data analysis and SPC; proficiency with JMP preferred
Fluency in MS Office suite
Strong problem solving and root cause analysis skills
Excellent written and verbal communication skills
Strong interpersonal, teaming, and presentation skills
Experience with process integration in a high volume manufacturing environment