About the role
- Develop and optimize next-generation first-of-a-kind wafer and die equipment to improve capability, productivity, and cost
- Take ideas from conception through equipment and sub-component development to implementation in APTD and manufacturing
- Identify, diagnose, and resolve equipment-related problems using failure analysis, FMEA, 8D, or FDC/Data Science methodology
- Coordinate and carry out equipment evaluation/optimization and implement changes
- Lead and participate in equipment maturity, availability improvement, and cost reduction activities
- Collaborate with process development, manufacturing, and equipment vendors to ensure robust processes
- Drive post probe wafer and assembly technology roadmaps with global manufacturing impact
Requirements
- Experience developing and optimizing next generation, first-of-a-kind (FAOK) wafer and die equipment (post probe wafer and die development)
- Ability to take ideas from conception through equipment and sub-component development to implementation
- Ability to identify, diagnose, and resolve equipment-related problems using failure analysis, FMEA, 8D, or FDC/Data Science methodology
- Experience coordinating and carrying out equipment evaluation and optimization to implement changes
- Experience leading and participating in equipment maturity, availability improvement, and cost reduction activities
- Strong collaboration skills to interact with process development, manufacturing, and equipment vendors
- Technical knowledge of equipment capability, productivity, and cost drivers
ATS Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard skills
wafer equipment developmentdie equipment developmentfailure analysisFMEA8D methodologyFDC/Data Science methodologyequipment evaluationequipment optimizationcost reductionprocess development
Soft skills
collaborationproblem-solvingleadership