Cadence Design Systems

Senior Principal Solutions Engineer – 3DIC

Cadence Design Systems

full-time

Posted on:

Location Type: Office

Location: San JoseCaliforniaUnited States

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Salary

💰 $143,500 - $266,500 per year

Job Level

About the role

  • defining and leading the development of advanced packaging and 3DIC analysis flows for foundry and customer solutions
  • have expert knowledge of the Cadence toolset and/or equivalent competitor toolsets in the context of multiple flows including high-speed signal design, power design, signal integrity, power integrity and definition of electrical constraints
  • design experience and industry knowledge of one of Signal, Power, and Thermal analysis associated with IC, package, or PCB design
  • have the ability to analyze the customer's environment and evaluate appropriate solutions
  • be knowledgeable and aware of competitive technologies
  • anticipate technical issues and develop creative solutions before they become a problem
  • take technical lead on a wide range of projects
  • ability to understand high-speed, high-performance signal and power integrity-related issues and work with peers and other business groups
  • able to communicate effectively with Cadence R&D, Product Engineering, Marketing and with customers
  • understand customer success criteria and is committed to ensuring customer success

Requirements

  • Bachelor’s degree (Masters preferred) in Electrical or Electronics Engineering
  • Minimum 15 years experience with Signal Integrity, Power Integrity, Electromagnetics, Thermal, and RF related to Package and PCB Design is required
  • 5+ years experience with Cadence SI/PI tools Allegro platform tools including: Sigrity, Clarity, PCB Editor, ICP preferred
  • Strong knowledge of advanced packaging concepts
  • Strong knowledge of 2.5D, 3DIC and stacked die technologies
  • Understanding of chip level CMOS design concepts desired
  • Strong customer-facing communication and problem-solving skills
  • Strong personal drive for continuous learning and expanding professional skill sets
  • Excellent verbal and written communication skills
Benefits
  • paid vacation and paid holidays
  • 401(k) plan with employer match
  • employee stock purchase plan
  • a variety of medical, dental and vision plan options
Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools
Signal IntegrityPower IntegrityElectromagneticsThermal AnalysisRF DesignAdvanced PackagingHigh-speed Signal DesignElectrical Constraints DefinitionCMOS Design Concepts3DIC Technologies
Soft Skills
Customer-facing CommunicationProblem-solvingTechnical LeadershipCreative Solutions DevelopmentContinuous LearningEffective CommunicationInterpersonal SkillsAnalytical SkillsCollaborationCustomer Success Commitment
Certifications
Bachelor’s Degree in Electrical EngineeringBachelor’s Degree in Electronics EngineeringMaster’s Degree in Electrical EngineeringMaster’s Degree in Electronics Engineering