IC Packaging Manager
BLUE ORIGIN
full-time
Posted on:
Location Type: Hybrid
Location: San Diego • California • Washington • United States
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Salary
💰 $230,773 - $323,081 per year
About the role
- Build and lead the package engineering team to deliver state-of-the-art packaging solutions for various RF/mmWave, MS, and Digital ASICs
- Define and manage simulation workflows for package-level signal integrity, EM, and thermal analysis
- Collaborate with IC designers and the payload group to establish package co-optimization methodologies across antenna, PCB, and die
- Support the ASIC central engineering team with validation & test board simulations
- Partner with OSATs to explore technology options and ensure mass production capabilities by streamlining design for manufacturability (DFM) rules for reliability and yield
- Oversee the package qualification process in collaboration with product and QA teams.
Requirements
- 12+ years of experience in mass-volume IC package development and production lifecycle
- Advanced degree (MS/PhD) in Electrical Engineering or a related field
- Extensive experience with thermal, electromagnetic, and signal integrity simulations at both package and system levels
- Knowledge of System in Package (SiP), Antenna in Package (AiP), and Multi-Chip Module (MCM) implementations
- Expertise in 2.5D/3D EM simulators (HFSS, EMX, Momentum, etc.) and package design software (Cadence Allegro APD, etc.)
- Experience with developing PDKs/ADKs in EDA CAD tools (Cadence, Keysight, etc.)
- Prior experience with beamformers & phased array implementation
- Experience in developing radiation-tolerant/hardened packages
- Experience mentoring early career engineers.
Benefits
- Medical, dental, vision, basic and supplemental life insurance
- Paid parental leave
- Short and long-term disability
- 401(k) with a company match of up to 5%
- Education Support Program
- Paid Time Off: Up to four (4) weeks per year based on weekly scheduled hours, and up to 14 company-paid holidays.
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills & Tools
IC package developmentthermal analysiselectromagnetic simulationssignal integrity simulationsSystem in Package (SiP)Antenna in Package (AiP)Multi-Chip Module (MCM)2.5D EM simulators3D EM simulatorsPDKs/ADKs development
Soft Skills
leadershipcollaborationmentoring
Certifications
MS in Electrical EngineeringPhD in Electrical Engineering