IC Packaging Manager

BLUE ORIGIN

IC Packaging Manager leading the TeraWave team at Blue Origin focused on advanced packaging technologies for space communication. Manage product cycle from design to production while aligning technology for space-based systems.

Posted 4/16/2026full-timeSan Diego • California, Washington • 🇺🇸 United StatesSeniorLead💰 $230,773 - $323,081 per yearWebsite

About the role

Key responsibilities & impact

Build and lead the package engineering team to deliver state-of-the-art packaging solutions for various RF/mmWave, MS, and Digital ASICs
Define and manage simulation workflows for package-level signal integrity, EM, and thermal analysis
Collaborate with IC designers and the payload group to establish package co-optimization methodologies across antenna, PCB, and die
Support the ASIC central engineering team with validation & test board simulations
Partner with OSATs to explore technology options and ensure mass production capabilities by streamlining design for manufacturability (DFM) rules for reliability and yield
Oversee the package qualification process in collaboration with product and QA teams.

Requirements

What you’ll need

12+ years of experience in mass-volume IC package development and production lifecycle
Advanced degree (MS/PhD) in Electrical Engineering or a related field
Extensive experience with thermal, electromagnetic, and signal integrity simulations at both package and system levels
Knowledge of System in Package (SiP), Antenna in Package (AiP), and Multi-Chip Module (MCM) implementations
Expertise in 2.5D/3D EM simulators (HFSS, EMX, Momentum, etc.) and package design software (Cadence Allegro APD, etc.)
Experience with developing PDKs/ADKs in EDA CAD tools (Cadence, Keysight, etc.)
Prior experience with beamformers & phased array implementation
Experience in developing radiation-tolerant/hardened packages
Experience mentoring early career engineers.

Benefits

Comp & perks

Medical, dental, vision, basic and supplemental life insurance
Paid parental leave
Short and long-term disability
401(k) with a company match of up to 5%
Education Support Program
Paid Time Off: Up to four (4) weeks per year based on weekly scheduled hours, and up to 14 company-paid holidays.

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills & Tools

IC package developmentthermal analysiselectromagnetic simulationssignal integrity simulationsSystem in Package (SiP)Antenna in Package (AiP)Multi-Chip Module (MCM)2.5D EM simulators3D EM simulatorsPDKs/ADKs development

Soft Skills

leadershipcollaborationmentoring

Certifications

MS in Electrical EngineeringPhD in Electrical Engineering