Work with cross-functional hardware engineering teams to develop advanced microelectronics packages including 3DHI, 3D, and 2.5D (interposer + chiplets) and novel material and process solutions for RF, digital, mixed-signal, and photonics products
Be involved in research efforts including initial concepts, advanced technology demonstrations, and will have the opportunity to follow product development from beginning to end, including documentation, fabrication, assembly, and test/delivery of a range of microelectronics products
Follow established procedures in creation of technical data package work products, while working closely with program management and functional supervision to ensure the overall design objectives are met.
Ability to work independently and in a team environment, including as a leader of small teams semiconductor manufacturing processes and materials.

Requirements

Typically requires a Bachelor’s in Science, Technology, Engineering, or Mathematics (STEM) degree or a minimum of 5 years’ prior relevant experience
Experience in circuit layout design using 2D CAD tools
Experience performing mechanical and electrical engineering design
Experience with semiconductor manufacturing processes and materials
Experience with high density microelectronic packaging designs including Interposers, organic substrates, wafer and chip bumping
Experience with electronic components / devices such as ASICs and FPGAs
Experience with the design of electronic packaging chassis and structures, interconnects (connectors/cables), and / or thermal management design of high-density electronic systems and electronic enclosures

Benefits

medical, dental, vision, life insurance
short-term disability
long-term disability
401(k) match
flexible spending accounts
flexible work schedules
employee assistance program
Employee Scholar Program
parental leave
paid time off
holidays

Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools

microelectronics packaging3DHI2.5Dcircuit layout designmechanical engineering designelectrical engineering designsemiconductor manufacturing processeshigh density microelectronic packagingelectronic componentsthermal management design

Soft Skills

independent workteam collaborationleadership

Certifications

Bachelor’s in Science, Technology, Engineering, or Mathematics (STEM)