Salary
💰 $119,200 - $178,800 per year
About the role
- Design and test sensor and radar cooling systems across airborne, ground mobile, ground stationery, and surface based naval domains
- Design and test advanced electronics thermal management solutions using heat transfer principles to meet optimal thermal performance
- Hands on experimental thermal research and thermal design verification for electronics cooling applications
- Perform electronics thermal analysis including liquid cooled, air-cooled, two-phase flow, and refrigeration thermal solutions for Mission Systems platforms
- Lead thermal designs by owning thermal requirement compliance, thermal architecture, and thermal performance of the design
- Mentor less experienced thermal engineers
- Provide oral and written presentations to internal and external customers and stakeholders
- Participate in test design, instrumentation selection, instrumentation application, and data acquisition for thermal experiments
Requirements
- Bachelor’s Degree with 8 years of experience, master’s degree with 6 years of experience, Ph.D. with 4 years of experience in Science, Technology, Engineering, Mathematics or related technical fields
- U.S Citizenship is required
- The ability to obtain/maintain a DoD Secret clearance
- The ability to work onsite daily at the Linthicum, MD/Baltimore facility
- Minimum of 6 years of heat transfer experimentation experience including test design, instrumentation selection, instrumentation application, and data acquisition
- Minimum of 6 years of expertise in design by analysis with a finite volume of finite difference software package
- Demonstrated application of advanced convective thermal management and design of single phase and two-phase thermal design for high heat flux/high power density applications using analytical, high fidelity, or experimental methods
- Minimum of 6 years of experience with automated control and acquisition of single phase and two-phase cooling loops, using tools like LabView to control National Instruments hardware, or similar (preferred)
- Minimum of 2 years of experience with one or more of the following software packages: ANSYS Icepak, ANSYS Thermal Desktop, ANSYS Fluent (preferred)
- Minimum of 6 years of experience proposing and leading R&D programs which address challenging customer thermal requirements (preferred)
- Minimum of 6 years of experience advancing the state of the art for next generation electronics thermal cooling (preferred)
- Prior experience leading the thermal design of systems, CCAs and microelectronics level thermal designs (preferred)
- Attention to detail and knowledge of basic electronics (AC and DC) with an emphasis on safety in the laboratory (preferred)
- Willingness to travel: Yes, 10% of the Time