Rivos Inc.

Thermal Engineer

Rivos Inc.

full-time

Posted on:

Origin:  • 🇺🇸 United States • California

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Job Level

SeniorLead

Tech Stack

AirflowPython

About the role

  • Perform the thermal design and analysis of semiconductor products, including integrated circuits, packages, modules, and complete systems, ensuring optimal thermal performance and reliability.
  • Develop and implement innovative air cooling and liquid cooling solutions for high-power density semiconductor devices, from concept generation to detailed design.
  • Conduct thermal simulations using advanced CFD tools (e.g., Icepak, Flotherm, Fluent) to predict temperature distributions, airflow patterns, and heat transfer characteristics.
  • Perform thermal design sensitivity analyses, trade-off studies, and optimization to meet performance, cost, and reliability targets
  • Perform transient thermal modeling of Rivos packages for thermal/power management.
  • Collaborate closely with mechanical, electrical, product engineering, and manufacturing teams to integrate thermal solutions seamlessly into product designs.
  • Execute thermal validation testing using wind tunnels, specialized mock-up systems, and other laboratory equipment.
  • Utilize data acquisition systems (DAQs), power supplies, thermal cameras, thermocouples, and other relevant instrumentation for accurate thermal measurements.
  • Develop and maintain detailed thermal models, documentation, and reports throughout the product development lifecycle.
  • Troubleshoot and resolve complex thermal issues during product development, qualification, and field deployment
  • Stay abreast of the latest advancements in thermal management technologies, materials, and simulation tools.
  • Participate in design reviews, FMEAs, and other quality assurance activities to ensure robust thermal designs.
  • Collaborate with CM, OEM and ODMs to develop mockups, test samples and production parts

Requirements

  • Minimum of 10 years of progressive experience in thermal engineering, specifically within the semiconductor and/or telecom industry.
  • Experienced in both air cooling and liquid cooling techniques for high-power electronic devices, covering the entire product lifecycle from development to deployment.
  • Experienced in semiconductor packaging. Strong understanding of heat transfer principles (conduction, convection, radiation) and fluid dynamics.
  • Proficiency in commercial CFD software packages, including but not limited to Icepak, Flotherm, and other industry-standard tools.
  • Hands-on experience with thermal testing methodologies, including the design and execution of experiments using wind tunnels, mock-up systems, and environmental chambers.
  • Proven ability to operate and interpret data from Data Acquisition Systems (DAQs), power supplies, thermal cameras, and other relevant thermal measurement equipment.
  • Experience with thermal interface materials (TIMs), heat sinks, heat pipes, cold plates, and other thermal management components.
  • Useful to have familiarity with OCP thermal/mechanical design guidelines and design of Colo boxes
  • Excellent problem-solving skills and a strong analytical mindset.
  • Effective written and verbal communication skills, with the ability to present complex technical information clearly and concisely.
  • Ability to work independently and as part of a cross-functional team in a fast-paced, dynamic environment.
  • Passionate for working in a startup environment.