Document package specifications, assembly steps, and change history in controlled systems.
Execute supplier-facing tasks (lot tracking, data requests) with OSATs under supervision.
Support feasibility assessments and basic package selection under guidance from senior engineers.
Perform basic electrical, mechanical, or thermal measurements per defined test plans.
Apply standard packaging procedures to support IC packaging builds and characterization DOEs.
Coordinate with internal teams to collect inputs and prepare engineering builds and samples.
Monitor yield and quality checkpoints; report anomalies and data trends to the project team.

Requirements

0–1 years related experience; internships or co‑ops acceptable.
Ability to coordinate with external suppliers under supervision and track builds/data.
Ability to follow standard procedures and work instructions with high attention to detail.
Effective written and verbal communication; clear documentation skills.
Foundational understanding of IC packaging concepts and basic manufacturing flow.
Proficiency with office tools and willingness to learn CAD/analysis tools quickly.

Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools

electrical measurementsmechanical measurementsthermal measurementsIC packagingpackaging proceduresdata trackingfeasibility assessmentsbasic manufacturing flow

Soft Skills

attention to detailwritten communicationverbal communicationdocumentation skillscoordination