Salary
💰 $122,400 - $183,600 per year
About the role
- Join Medtronic’s innovative team to shape the future of advanced packaging technologies, including PCBA, Wafer Scale, and 3D integration. In this role, you’ll develop and maintain high-performance Electrical Design Automation (EDA) environments, tools, and methodologies that accelerate design cycles and improve quality, reliability, and manufacturability. In-person exchanges are invaluable to our work. We’re working a minimum of 4 days a week onsite as part of our commitment to fostering a culture of professional growth and cross-functional collaboration as we work together to engineer the extraordinary. Responsibilities may include the following and other duties may be assigned. Develop, maintain, and document EDA environments supporting advanced packaging technologies. Provide direct support for design tools and methodologies, including simulation, verification, prototyping, and physical implementation. Guide packaging design teams from concept through production with proactive technical expertise. Lead the creation of new design flows, processes, and tools to improve productivity and innovation. Collaborate with R&D to advance state-of-the-art packaging processes. Deliver methodology training and support for global design teams. Mentor and train junior engineers to develop technical skills and best practices. Serve as the primary point of contact for internal customers and stakeholders. Install, upgrade, configure, and manage tool licenses. Integrate tool flows into the Medtronic design environment. Conduct Method Validations to release software for production use. Troubleshoot tool issues and coordinate with vendors. Stay ahead of EDA industry trends and adapt tools accordingly. Provide guidance on technical computing resources and budget input for tools and maintenance.
Requirements
- Requires a Baccalaureate degree Minimum 7 years of relevant experience, or advanced degree with a minimum of 5 years of relevant experience. Nice to Have Deep knowledge of packaging technologies, design methodologies, simulation, verification, layout, and test (primarily Cadence tools). Proficiency in SystemVerilog and Verilog AMS. Working knowledge of Cadence APD+ (System Capture, layout, physical verification), Cadence PVS, and Mentor Calibre LVS, xRC, DRC. Proficiency in Linux and Windows operating systems. Strong problem-solving skills and a customer-focused mindset.