Collaborate with IC design, physical layout, assembly engineering, and marketing to support package planning and substrate design
Build and correlate SI/PI models for advanced interconnects; perform 2D/3D EM simulations and generate routing, stack‑up, and decoupling guidelines
Analyze power‑distribution networks and high‑speed signal paths from pre‑layout through post‑layout
Perform VNA and TDR characterization of package/PCB structures and compare bench data with simulations
Automate analysis workflows using Python (e.g., simulation sweeps, reporting, rule checks)
Document technical results and present recommendations to cross‑functional teams
Contribute to design reviews and support the release of package designs to manufacturing
Use tools such as HFSS, SI‑Wave/Clarity, PowerSI, Spectre/ADS/HSpice, and APD or PADS.

Requirements

MS or PhD in Electrical/Electronics Engineering, Materials Science, or related fields
Strong fundamentals in electromagnetics, transmission lines, and microwave theory
Experience with 2D/3D EM simulation tools (HFSS, SI‑Wave, Clarity)
Familiarity with IC package layout tools such as APD or PADS
Understanding of high‑speed signaling in both frequency and time domain
Exposure to VNA/TDR characterization methods
Working knowledge of circuit‑simulation tools (Spectre, ADS, HSpice)
Python scripting experience for SI/PI or packaging automation
Familiarity with packaging technologies, materials, substrate design rules, and assembly processes
Awareness of EMI/EMC debugging and simulation practices
Bonus: Experience with 2.5D/3D package development, MATLAB‑based channel simulations, or basic thermal/mechanical analysis
Strong communication, presentation, and documentation skills
A collaborative team player eager to learn and grow.

Benefits

Employee stock purchase plan with a 2-year look back
Family support programs to help balance work and home life
Robust mental health resources to prioritize emotional well-being
Recognition and service awards to celebrate contributions and milestones

Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools

electromagneticstransmission linesmicrowave theory2D EM simulation3D EM simulationVNA characterizationTDR characterizationPython scriptingcircuit simulationhigh-speed signaling

Soft Skills

communicationpresentationdocumentationcollaborationteam playereager to learnproblem-solving

Certifications

MS in Electrical EngineeringPhD in Electrical EngineeringMS in Electronics EngineeringPhD in Electronics EngineeringMS in Materials SciencePhD in Materials Science