Intel Corporation

Module Development Engineer – Hybrid Bonding

Intel Corporation

full-time

Posted on:

Location Type: Hybrid

Location: HillsboroOregonUnited States

Visit company website

Explore more

AI Apply
Apply

Salary

💰 $99,030 - $139,810 per year

Tech Stack

About the role

  • Owning execution of maintenance and repair activities for equipment and relevant module of components.
  • Initiates and owns the continuous improvement of equipment and process for key performance indicators (e.g., safety, quality, cost, productivity, defects, and yield).
  • Engaging in hands-on training and development activities, managing process equipment and hardware, ensuring optimal functionality and availability.
  • Owning process development line items aligned to high volume process nodes.
  • Participates in the transfer of technology to other sites through training and audit of installation and qualification outcomes to ensure matched processing across sites.
  • Assessing, improving, and optimizing processing techniques and methods used in high-volume manufacturing settings, ensuring safety and quality standards are met.
  • Improving safety, maintenance, and operational procedures for engineers and technicians.
  • Providing expert technical support to manufacturing operations, aiding in the resolution of complex issues through comprehensive analysis of variable factors.
  • Owning New Product Introduction, leading integration of new technologies, ensuring seamless transitions.
  • During factory ramps, owning equipment install/conversion and qualification to ensure tools are installed safely and on schedule, while meeting all quality/matching criteria.

Requirements

  • MS Degree in mechanical engineering, Electrical and/or Electronic Engineering, Chemical Engineering, Computer Engineering, or related STEM field.
  • Interested in fab process with database experience and analysis knowledge in Excel, JMP, Power Query, SQL, MATLAB, SOLIDWORKS, JMP, Power BI, Arduino, C++, Python, MES.
  • Technical knowledge in statistical process control, commonality analysis, design of experiment and failure modes/effects analysis (FMEA).
  • Graduates with up to 2 years of relevant experience; prior experience in the semiconductor industry and a manufacturing environment will be considered an advantage.
Benefits
  • competitive pay
  • stock
  • bonuses
  • health
  • retirement
  • vacation
Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools
statistical process controlcommonality analysisdesign of experimentfailure modes/effects analysisprocess optimizationequipment maintenanceprocess developmenttechnical supportnew product introductionmanufacturing techniques
Soft Skills
hands-on trainingproblem-solvingcommunicationleadershipcollaborationanalytical thinkingcontinuous improvementproject managementadaptabilityattention to detail