
Module Development Engineer – Hybrid Bonding
Intel Corporation
full-time
Posted on:
Location Type: Hybrid
Location: Hillsboro • Oregon • United States
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Salary
💰 $99,030 - $139,810 per year
About the role
- Owning execution of maintenance and repair activities for equipment and relevant module of components.
- Initiates and owns the continuous improvement of equipment and process for key performance indicators (e.g., safety, quality, cost, productivity, defects, and yield).
- Engaging in hands-on training and development activities, managing process equipment and hardware, ensuring optimal functionality and availability.
- Owning process development line items aligned to high volume process nodes.
- Participates in the transfer of technology to other sites through training and audit of installation and qualification outcomes to ensure matched processing across sites.
- Assessing, improving, and optimizing processing techniques and methods used in high-volume manufacturing settings, ensuring safety and quality standards are met.
- Improving safety, maintenance, and operational procedures for engineers and technicians.
- Providing expert technical support to manufacturing operations, aiding in the resolution of complex issues through comprehensive analysis of variable factors.
- Owning New Product Introduction, leading integration of new technologies, ensuring seamless transitions.
- During factory ramps, owning equipment install/conversion and qualification to ensure tools are installed safely and on schedule, while meeting all quality/matching criteria.
Requirements
- MS Degree in mechanical engineering, Electrical and/or Electronic Engineering, Chemical Engineering, Computer Engineering, or related STEM field.
- Interested in fab process with database experience and analysis knowledge in Excel, JMP, Power Query, SQL, MATLAB, SOLIDWORKS, JMP, Power BI, Arduino, C++, Python, MES.
- Technical knowledge in statistical process control, commonality analysis, design of experiment and failure modes/effects analysis (FMEA).
- Graduates with up to 2 years of relevant experience; prior experience in the semiconductor industry and a manufacturing environment will be considered an advantage.
Benefits
- competitive pay
- stock
- bonuses
- health
- retirement
- vacation
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills & Tools
statistical process controlcommonality analysisdesign of experimentfailure modes/effects analysisprocess optimizationequipment maintenanceprocess developmenttechnical supportnew product introductionmanufacturing techniques
Soft Skills
hands-on trainingproblem-solvingcommunicationleadershipcollaborationanalytical thinkingcontinuous improvementproject managementadaptabilityattention to detail