Transport Media and Materials Engineer
Intel Corporation
full-time
Posted on:
Location Type: Hybrid
Location: Phoenix • Arizona • Oregon • United States
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Salary
💰 $133,800 - $188,890 per year
About the role
- design and develop shipping packaging solutions for wafer-level, component-level, and system-board products
- create new packaging designs and define requirements
- conduct qualification testing
- manage project timelines to meet startup schedules and cost targets
- lead pathfinding projects to advance packaging technology
- perform materials research on corrugated papers and cushions
- provide consultation on packaging improvements
Requirements
- Bachelor’s degree in Packaging Engineering, Mechanical Engineering, or a related field
- 3+ years of packaging engineering experience (electronics/semiconductor preferred)
- Proficiency with packaging design software and CAD tools
- Knowledge of packaging materials and testing standards (ASTM, ISTA)
- Strong project management and analytical skills
Benefits
- competitive pay
- stock bonuses
- health
- retirement
- vacation
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills & Tools
packaging designqualification testingmaterials researchpackaging materialstesting standardsproject managementanalytical skills
Soft Skills
leadershipconsultation
Certifications
Bachelor’s degree in Packaging EngineeringBachelor’s degree in Mechanical Engineering