
Semiconductor Packaging Mechanical Engineer
Intel Corporation
full-time
Posted on:
Location Type: Hybrid
Location: Phoenix • Arizona • Oregon • United States
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Salary
💰 $122,440 - $232,190 per year
About the role
- Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages.
- Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures.
- Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations.
- Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms.
Requirements
- PhD Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with emphasis in solid mechanics
- 3+ years of Thermal-mechanical work/research experience with emphasis on silicon reliability
- 3+ years of experience with Finite Element Analysis tools
- 3+ years of experience with experimental material characterization metrologies such as DMA/TMA and nano-indentation.
- Experience with multi-physics simulations, including coupled electro-thermal-mechanical analysis
- Experience with designing, planning and executing experiments
Benefits
- Competitive pay
- Stock bonuses
- Health insurance
- Retirement plans
- Paid time off
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills & Tools
finite element analysisthermal-mechanical analysisexperimental material characterizationDMATMAnano-indentationmulti-physics simulationscoupled electro-thermal-mechanical analysisdesigning experimentsplanning experiments
Soft Skills
collaborationcommunicationproblem-solvinganalytical thinkingactionable recommendations
Certifications
PhD in Mechanical EngineeringPhD in Chemical EngineeringPhD in Material Sciences