Intel Corporation

Semiconductor Packaging Mechanical Engineer

Intel Corporation

full-time

Posted on:

Location Type: Hybrid

Location: PhoenixArizonaOregonUnited States

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Salary

💰 $122,440 - $232,190 per year

About the role

  • Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages.
  • Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures.
  • Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations.
  • Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms.

Requirements

  • PhD Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with emphasis in solid mechanics
  • 3+ years of Thermal-mechanical work/research experience with emphasis on silicon reliability
  • 3+ years of experience with Finite Element Analysis tools
  • 3+ years of experience with experimental material characterization metrologies such as DMA/TMA and nano-indentation.
  • Experience with multi-physics simulations, including coupled electro-thermal-mechanical analysis
  • Experience with designing, planning and executing experiments
Benefits
  • Competitive pay
  • Stock bonuses
  • Health insurance
  • Retirement plans
  • Paid time off
Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools
finite element analysisthermal-mechanical analysisexperimental material characterizationDMATMAnano-indentationmulti-physics simulationscoupled electro-thermal-mechanical analysisdesigning experimentsplanning experiments
Soft Skills
collaborationcommunicationproblem-solvinganalytical thinkingactionable recommendations
Certifications
PhD in Mechanical EngineeringPhD in Chemical EngineeringPhD in Material Sciences