Senior Silicon Application Engineer – Packaging Design
Intel Corporation
full-time
Posted on:
Location Type: Hybrid
Location: Phoenix • Arizona • California • United States
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Salary
💰 $164,470 - $311,890 per year
Job Level
About the role
- Establish technical credibility, building trust and strong relationships with Intel Foundry ADG customers
- Ensure customers successfully evaluate, adopt, and design products using Intel process technology
- Serve as primary technical expert on packaging design tools and implementation methodologies
- Analyze customer design issues and environments to define functional specifications for EDA vendors
- Work closely with customers on advanced packaging technologies including multi-die/3DIC platforms
- Consult on packaging design challenges and provide innovative technical solutions
- Collaborate with Intel engineering teams to address customer requirements and technical challenges
Requirements
- US Citizenship required
- Ability to obtain US Government Security Clearance
- Bachelor's degree in Electrical Engineering, Computer Engineering, or STEM-related field
- 7+ years of experience in Package Design and relevant EDA tools
- Experience interfacing with customers and/or stakeholders
- Experience analyzing customer design issues, environments, and defining functional specifications for EDA vendors
Benefits
- Competitive compensation
- Professional development in advanced packaging and foundry services
- Direct impact on Intel's foundry business growth and customer success
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard skills
Package DesignEDA toolsfunctional specificationspackaging design toolsmulti-die platforms3DIC platformstechnical solutionsdesign analysis
Soft skills
technical credibilityrelationship buildingcustomer consultationcollaborationproblem-solving
Certifications
US Government Security Clearance