Structural Project Engineer
Thornton Tomasetti
Senior Foundry Device Engineer
Intel Corporation
full-time
Posted on:
Location Type: Office
Location: Phoenix • Arizona, Oregon • 🇺🇸 United States
Visit company websiteSalary
💰 $136,990 - $193,390 per year
Job Level
Senior
About the role
- Collaborate with Development teams to create new device technologies and customize advanced device architectures to meet specific customer needs.
- Drive the development and implementation of customized semiconductor device technologies, ensuring seamless integration with Intel's existing manufacturing processes and platforms.
- Partner with manufacturing teams to develop and refine fabrication processes that consistently meet device specifications and yield targets.
- Develop CMOS logic device technologies with embedded features for various foundry customers in large-volume production environments.
- Own NPI (New Product Introduction) activities in production fabs, performing product-specific device characteristics optimizations and design of experiments (DOE).
- Lead foundry NPI activities and troubleshoot tape-out issues with exceptional technical problem-solving capabilities.
- Utilize advanced data analysis, scripting, and analytical techniques to accelerate learning and drive continuous improvement.
- Interpret complex product data including inline, e-test, and SORT data to identify failure root causes and develop effective solutions.
- Provide technical guidance and mentorship to junior device engineers, fostering a culture of continuous learning and development.
- Lead and influence cross-functional teams while managing multiple project timelines and deliverables.
Requirements
- Bachelor's Degree in Electrical Engineering, Physics, or related field with 7+ years of experience in CMOS device engineering, device physics, logic architecture, and interconnect development on leading-edge technology nodes.
- Advanced CMOS device technology, preferably in a foundry environment.
- Foundry NPI.
- Device targeting and corner skew.
- IC wafer fabrication process engineering, manufacturing systems, semiconductor materials, and wafer testing across various fabrication areas including photolithography, advanced patterning, thin film deposition, planarization, defect metrology, and spectroscopy.
- Interpreting product data including inline, e-test, and SORT data, finding failure root cause and inline indicators, and driving for solutions.
Benefits
- competitive pay
- stock
- bonuses
- health
- retirement
- vacation
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard skills
CMOS device engineeringdevice physicslogic architectureinterconnect developmentNPI (New Product Introduction)data analysisscriptingdesign of experiments (DOE)IC wafer fabrication process engineeringsemiconductor materials
Soft skills
technical problem-solvingmentorshipcross-functional team leadershipproject managementcommunication
