The Application Engineer will serve as the technical interface of the Business Unit—owning all technical customer communication, and cross‑ecosystem collaboration.
This role is responsible for developing deep technical relationships with leading semiconductor manufacturers, tester/prober partners and major fabless/OSAT partners.
Act as the first line of defense for all technical questions from Customers, Sales and BU teams.
Help reduce the support burden on R&D by owning early‑stage technical discussions, supporting post‑sales issues, and translating customer needs into product requirements, documentation, and roadmap insights.
Bridge engineering, customers, and industry partners to elevate FormFactor’s technical leadership in advanced wafer probe and probe card solutions.
Drive customer evaluations of new and current probe card designs.
Serve as the BU’s primary escalation point for Pre and post‑sales technical questions before involving engineering.
Troubleshoot probe/probe card performance issues in collaboration with Sales, Field Engineering, and R&D when needed.
Develop high-quality technical papers, application notes, whitepapers, and pre-release documentation.
Provide clear technical explanations, root-cause thinking, and usage guidance to improve customer outcomes.
Capture customer needs, test challenges, and requirements to feed into product strategy and R&D planning.

Requirements

Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Semiconductor Engineering, or similar technical field.
Working knowledge of probe cards, advanced probes, or wafer-level test solutions.
Familiarity with semiconductor sort tests, wafer probe processes, and test cell integration.
Ability to explain complex technical subjects to customers with clarity and confidence.
Strong communication skills in English, written and spoken.
Knowledge of Mandarin preferred.
Ability to travel frequently between the U.S., Taiwan, Europe if based outside Taiwan.
Experience working with leading foundries/IDMs.
Hands-on experience with ATE platforms, probers, or OSAT test environments.
Knowledge of semiconductor wafer processes such as bumping, hybrid bonding, packaging, or advanced node manufacturing.
Experience writing technical papers, presentations, or customer-facing engineering documentation.
Familiarity with GPU/CPU/HPC device testing is a strong plus.

Benefits

medical
dental
vision
life insurance
disability coverage
a 401(k) with company match
employee stock purchase plan (ESPP)
paid time off
quarterly profit-sharing bonuses
flexible spending or savings accounts

Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools

Electrical EngineeringMechanical EngineeringMaterials ScienceSemiconductor Engineeringprobe cardswafer-level test solutionssemiconductor sort testswafer probe processesATE platformsGPU/CPU/HPC device testing

Soft Skills

communication skillsclarityconfidenceroot-cause thinking