Develop new reliability test flows (eg: extended wafer level burn in, pWLRx, ELFR etc) for DRAM, interface die and stacked HBM products for extrinsic DPM (Time0 and Field DPM) and intrinsic reliability assessment to meet KPI’s Quality, Cost and Cycle Time
Write and debug reliability test programs for HBM device and package qualification
Perform root cause understanding and resolution of reliability test program related issues
Promote innovation and challenge the status quo by developing new reliability features, solutions, and code infrastructure optimizations
Collaborate cross-functionally with Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams
Utilize in-house statistical tools for engineering data analysis for validation and risk assessment
Define interface hardware specifications and perform validation and debug of new interface boards
Make technical decisions on risk analysis and project prioritization
Mentor and develop team members
Develop project management skills within the team and drive process improvements, continuous cost reduction and quality improvement efforts
Requirements
Bachelors/Masters Electrical and Electronics Engineering Degree
5+ years of experience in the semiconductor industry
Product or Test Engineering experience preferred
Strong knowledge of coding / programming languages such as Python / C++
Proven experience in reliability engineering or a related role
Demonstrating Strong Technical Skills, especially in problem solving with root cause understanding and solution space
Attention to detail
Basic understanding of CMOS technology and DRAM device physics and design
Good multi-tasking skills and ability to set priorities in a fast moving, dynamic environment
Good knowledge of statistics and data analysis tools and scripting
Familiar with testing verification approach
Effective communication skills in written and spoken English
Ability to successfully implement and strictly adhere to testing protocols
Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems
Willingness to work on site in Singapore with international travel to US, Taiwan and Japan
ATS Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
attention to detailmulti-taskingprioritizationeffective communicationcollaborationmentoringinnovationprocess improvementrisk analysistechnical decision making
Certifications
Bachelors in Electrical EngineeringMasters in Electrical Engineering