Eightfold

3D Stacked Memory Architect

Eightfold

full-time

Posted on:

Location Type: Office

Location: Boise • California • Idaho • United States

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Salary

💰 $177,000 - $387,000 per year

About the role

  • Define next-generation 3D stacked memory architectures spanning bandwidth, capacity, power efficiency, and RAS
  • Lead die-to-system co-optimization across memory die, PHY, TSVs, bonding, packaging, and system integration
  • Architect stack-aware RAS, telemetry, and reliability mechanisms for high-density memory systems
  • Drive long-range technology strategy for stacked memory and advanced packaging
  • Engage deeply with customers, platform partners, and standards bodies to influence system and ecosystem direction

Requirements

  • Bachelor’s degree or equivalent practical experience in Electrical Engineering, Computer Engineering, Computer Science, or a related field
  • Extensive industry experience in stacked memory, 3D integration, advanced packaging, or high-performance semiconductor architecture
  • Deep hands-on expertise in high-speed I/O, TSV-based stacking, power delivery, thermals, and signal integrity
  • Proven ability to translate system-level requirements into memory and package architecture
  • Demonstrated technical leadership across teams and complex architectural decisions
  • Master’s degree or PhD in Electrical Engineering or a related technical field (preferred)
  • Recognized expertise in stacked memory or advanced packaging, internally or externally (preferred)
  • Experience influencing tier-1 customers, platform architects, or industry standards (preferred)
  • Track record of architectural innovations shipped in production silicon or platforms (preferred)
  • Experience mentoring senior engineers or architects (preferred)
Benefits
  • Choice of medical, dental and vision plans
  • Benefit programs that help protect your income due to illness or injury
  • Paid family leave
  • Robust paid time-off program
  • Paid holidays
Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools
3D stacked memory architecturesdie-to-system co-optimizationstack-aware RAStelemetry mechanismsreliability mechanismshigh-speed I/OTSV-based stackingpower deliverythermalssignal integrity
Soft Skills
technical leadershipmentoringinfluencingcollaboration
Certifications
Bachelor’s degree in Electrical EngineeringBachelor’s degree in Computer EngineeringBachelor’s degree in Computer ScienceMaster’s degree in Electrical EngineeringPhD in Electrical Engineering