Provide pre-sales technical leadership for Ciena's Interconnects portfolio across hyperscalers, OEMs, and AI/compute system partners.
Lead lab bring-up, debug, interoperability validation, configuration, and performance testing.
Translate customer system architectures and requirements into technical solutions and roadmap inputs.
Support quoting decisions, technical documentation, product collateral, compliance materials, and solution configuration.
Partner with BD and account teams to guide complex design-win cycles from evaluation to production.
Serve as primary technical interface for proof-of-concepts (POCs), interoperability events, compliance, and early deployments.
Deliver technical workshops, product demos, architecture sessions, and executive-level technical briefings.
Provide competitive intelligence, ecosystem developments, and silicon/optics trends to influence PLM and roadmap alignment.
Support post-sales issue triage with R&D, sustaining engineering, and quality teams — ensuring customer success during scale-up.
Advocate for customer requirements while balancing PLM strategy, roadmap alignment, and commercial constraints.

Requirements

7–12 years in FAE, solutions engineering, high-speed hardware, optical interconnect, silicon bring-up, or datacenter systems engineering.
Deep familiarity with one or more of: DSP/retimer, SERDES, optics/pluggables, AEC/ACC, PCIe, Ethernet, high-speed test equipment.
Experience working directly with hyperscalers (AWS, Google, Meta, Microsoft, etc.) and/or major OEMs (Cisco, Arista, HPE/Juniper, etc.).
Hands-on debugging with oscilloscopes, BERTs, IBIS-AMI, simulation, or signal integrity tools.
Ability to engage simultaneously at engineering depth and executive clarity.
BS in Electrical Engineering, Computer Engineering, or similar required; MS preferred.
Strong communication, documentation, and presentation skills — able to translate between engineering, PLM, and commercial audiences.

Benefits

Medical, dental, and vision plans
Participation in 401(K) (USA) & DCPP (Canada) with company matching
Employee Stock Purchase Program (ESPP)
Employee Assistance Program (EAP)
Company-paid holidays
Paid sick leave
Vacation time

Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools

high-speed hardwareoptical interconnectsilicon bring-upDSPretimerSERDESAECACCPCIeEthernet

Soft Skills

communicationdocumentationpresentationtechnical leadershipcustomer advocacycollaborationproblem-solvingtechnical interfaceexecutive clarityinfluencing

Certifications

BS in Electrical EngineeringBS in Computer EngineeringMS in Electrical EngineeringMS in Computer Engineering