Applied Materials

Process Engineer – Die to Wafer Hybrid Bonding, Silicon Photonics / CPO, R&D

Applied Materials

full-time

Posted on:

Location Type: Office

Location: Santa ClaraCaliforniaUnited States

Visit company website

Explore more

AI Apply
Apply

Salary

💰 $147,000 - $202,500 per year

About the role

  • design and optimize manufacturing processes for display and semiconductor manufacturing technologies
  • collect and analyze data, perform hardware characterization, and troubleshoot engineering issues
  • measure film properties, generate technical documentation, and engage with customers to resolve concerns
  • collaborate with vendors and suppliers
  • experiment and learn on state‑of‑the‑art equipment along with R&D teams

Requirements

  • M.S. or Ph.D. in Materials Science, Electrical Engineering, Mechanical Engineering, Applied Physics, or a related STEM discipline
  • In‑depth knowledge and hands‑on experience in one or more of the following: Die‑to‑wafer or wafer‑to‑wafer bonding, Thin‑die handling and alignment‑critical processes, Semiconductor processing and 2.5D/3D integration
  • Strong understanding of: Bond interface physics, Alignment and overlay fundamentals, Mechanical behavior of thin and fragile dies
  • Proficiency in statistical analysis and process control (e.g., DOE, SPC, JMP)
  • Self‑starter with strong problem‑solving skills; able to work both independently and collaboratively
  • Strong communication and interpersonal skills, with the ability to collaborate effectively across multidisciplinary teams.
Benefits
  • supportive work culture that encourages learning, development, and career growth
  • programs and support for health and wellbeing
  • opportunities for personal and professional growth
Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools
manufacturing processeshardware characterizationfilm properties measurementstatistical analysisprocess controlDOESPCJMPsemiconductor processing2.5D/3D integration
Soft Skills
problem-solvingcollaborationcommunicationinterpersonal skillsself-starter
Certifications
M.S. in Materials SciencePh.D. in Materials ScienceM.S. in Electrical EngineeringPh.D. in Electrical EngineeringM.S. in Mechanical EngineeringPh.D. in Mechanical EngineeringM.S. in Applied PhysicsPh.D. in Applied Physics