
Process Engineer – Die to Wafer Hybrid Bonding, Silicon Photonics / CPO, R&D
Applied Materials
full-time
Posted on:
Location Type: Office
Location: Santa Clara • California • United States
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Salary
💰 $147,000 - $202,500 per year
About the role
- design and optimize manufacturing processes for display and semiconductor manufacturing technologies
- collect and analyze data, perform hardware characterization, and troubleshoot engineering issues
- measure film properties, generate technical documentation, and engage with customers to resolve concerns
- collaborate with vendors and suppliers
- experiment and learn on state‑of‑the‑art equipment along with R&D teams
Requirements
- M.S. or Ph.D. in Materials Science, Electrical Engineering, Mechanical Engineering, Applied Physics, or a related STEM discipline
- In‑depth knowledge and hands‑on experience in one or more of the following: Die‑to‑wafer or wafer‑to‑wafer bonding, Thin‑die handling and alignment‑critical processes, Semiconductor processing and 2.5D/3D integration
- Strong understanding of: Bond interface physics, Alignment and overlay fundamentals, Mechanical behavior of thin and fragile dies
- Proficiency in statistical analysis and process control (e.g., DOE, SPC, JMP)
- Self‑starter with strong problem‑solving skills; able to work both independently and collaboratively
- Strong communication and interpersonal skills, with the ability to collaborate effectively across multidisciplinary teams.
Benefits
- supportive work culture that encourages learning, development, and career growth
- programs and support for health and wellbeing
- opportunities for personal and professional growth
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills & Tools
manufacturing processeshardware characterizationfilm properties measurementstatistical analysisprocess controlDOESPCJMPsemiconductor processing2.5D/3D integration
Soft Skills
problem-solvingcollaborationcommunicationinterpersonal skillsself-starter
Certifications
M.S. in Materials SciencePh.D. in Materials ScienceM.S. in Electrical EngineeringPh.D. in Electrical EngineeringM.S. in Mechanical EngineeringPh.D. in Mechanical EngineeringM.S. in Applied PhysicsPh.D. in Applied Physics