The College of Education at The University of Texas at Austin

Senior/Principal TCAD Engineer

The College of Education at The University of Texas at Austin

full-time

Posted on:

Location Type: Hybrid

Location: Austin • Texas • United States

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Job Level

Senior

About the role

  • Develop and validate multi-physics, silicon-calibrated TCAD models for 3DHI devices and interfaces to predict performance and reliability.
  • Develop and own TCAD modeling frameworks for advanced devices and interfaces relevant to 3DHI, including hybrid bonding contacts, TSVs, BEOL interconnects, and emerging device structures.
  • Perform multi-physics simulations (electrical, thermal, mechanical, and reliability) to predict performance, variability, and failure mechanisms across stacked, heterogeneous die systems.
  • Co-optimize devices, interconnect, and packaging designs by working closely with process integration, packaging, and circuit teams to close the loop between fabrication, measurement, and simulation.
  • Calibrate and validate TCAD models using silicon data from wafer-level test vehicles and process monitors; drive model-to-hardware correlation across corners and stress conditions.
  • Define simulation methodologies and best practices for 3D device and interface modeling (e.g., contact resistance, current crowding, electromigration, thermo-mechanical stress).
  • Engage with foundry, EDA, and materials partners to influence next-generation TCAD tool features and process design enablement for 3D-stacked systems.
  • Author technical documentation, modeling guidelines, and reference flows to support ecosystem adoption of TIE’s device and interface platforms.
  • Mentor junior engineers and technical staff, setting standards for modeling rigor and engineering judgment across the organization.

Requirements

  • Ph.D. or M.S. in Electrical Engineering, Materials Science, Applied Physics, or a closely related field with strong emphasis on device physics and numerical simulation.
  • 8+ years (Senior) or 12+ years (Principal) of hands-on experience with TCAD for semiconductor devices or interconnects.
  • Deep understanding of semiconductor device physics (MOSFETs, diodes, contacts) and transport mechanisms relevant to nanoscale and 3D structures.
  • Proficiency with commercial TCAD tools such as Synopsys Sentaurus, Silvaco Atlas/Victory, or equivalent multi-physics simulation environments.
  • Experience correlating TCAD models with silicon data and extracting physical parameters from measurements.
  • Strong background in process integration effects (doping, defects, interfaces, stress, and materials).
  • Ability to work cross-functionally with process, packaging, EDA, and system teams in a fast-moving R&D environment.
  • Relevant education and experience may be substituted as appropriate.
Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools
TCAD modelingmulti-physics simulationsdevice physicsnumerical simulationcorrelating TCAD modelsextracting physical parametersprocess integration effectselectrical transport mechanismsthermal simulationsmechanical simulations
Soft Skills
mentoringcross-functional collaborationengineering judgmenttechnical documentationcommunication