The College of Education at The University of Texas at Austin

Thermal Mechanical Modeling Engineer

The College of Education at The University of Texas at Austin

full-time

Posted on:

Location Type: Office

Location: Austin • Texas • 🇺🇸 United States

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Job Level

Mid-LevelSenior

Tech Stack

Python

About the role

  • Own and execute hands-on semiconductor package mechanical and thermal simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages.
  • Perform modeling, extraction, and verification of high-speed interconnects, power delivery networks, thermal management, and mechanical stress across chiplets and advanced substrates.
  • Build and validate comprehensive ADK/PDK models (electrical, EM, thermal, mechanical) that accurately represent package-level behavior and enable system-level co-design.
  • Run end-to-end simulation workflows including thermal/structural reliability checks, and co-simulation across domains.
  • Collaborate directly with EDA vendors (Cadence, Ansys, Synopsys, Siemens, Keysight, etc.), OSATs, and foundries to develop, test, and refine package simulation flows.
  • Generate user guides, reference flows, scripts, and automation that make SI/PI/multiphysics enablement repeatable and accessible to design teams.
  • Stay current with next-gen interface standards (PCIe Gen6/7, CXL, UCIe, UALink, SerDes, HBM) and incorporate their requirements into package design methodologies.
  • Guide technical strategy for SI/PI flows, mentor junior engineers, and represent TIE in working groups, customer design reviews, and industry forums.
  • Other related functions as assigned.

Requirements

  • Engineer: BS in Electrical Engineering, Computer Engineering, Applied Physics, or related discipline.
  • 3 or more years of direct, hands-on experience in multiphysics simulations for advanced packaging, 2.5D/3DIC, or heterogeneous integration platforms.
  • Strong expertise with EDA/EM/multiphysics tools: Ansys HFSS/SIwave, Cadence Sigrity/Clarity, Synopsys RaptorX, Siemens HyperLynx, Keysight ADS, COMSOL, CST Studio.
  • Proven ability to extract/package-level models (dielectric/thermal constants, warpage/stress data) and integrate them into design enablement flows.
  • Hands-on scripting/automation skills (Python, Tcl, SKILL, etc.) to streamline simulation flows.
  • You’re energized by ambiguity, act with urgency, and take personal ownership for outcomes. You make things happen. Execution mindset.
  • You have demonstrated experience working in a hands-on role driving progress across multiple initiatives without layers of management.
  • Location. Austin, Texas is required for close collaboration with our engineering teams and partners.
  • Senior Engineer: MS or PhD in Electrical Engineering, Applied Physics, or related discipline.
  • 5 or more years of direct, hands-on experience in multiphysics simulations for advanced packaging, 2.5D/3DIC, or heterogeneous integration platforms.
  • Deep experience with multi-material packages (Si, glass, organics, Cu, RDL, TSV, hybrid bonding, etc.).
  • Expertise in system-level co-simulation spanning electrical, thermal, and mechanical domains for high-power/high-bandwidth-density packages.

Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard skills
multiphysics simulationsthermal simulationsmechanical simulationsmodelingextractionverificationscriptingautomationco-simulationpackage-level modeling
Soft skills
execution mindsetownershipurgencycollaborationmentoringproblem-solvingadaptabilityinitiativecommunicationleadership
Certifications
BS in Electrical EngineeringBS in Computer EngineeringBS in Applied PhysicsMS in Electrical EngineeringMS in Applied PhysicsPhD in Electrical EngineeringPhD in Applied Physics