Senior FPGA Design Engineer
The Reliable Companies
Senior Principal MMIC Design Engineer
Teledyne Technologies Incorporated
full-time
Posted on:
Location Type: Office
Location: Mountain View • California, Texas • 🇺🇸 United States
Visit company websiteSalary
💰 $161,300 - $215,100 per year
Job Level
Senior
About the role
- Perform detailed design, simulation, layout, and validation of advanced GaN and GaAs MMIC products, with a focus on high-power amplifiers operating at RF, microwave, and millimeter-wave frequencies.
- Define MMIC specifications based on system-level customer requirements and trade-off analyses.
- Utilize industry-standard simulation tools (ADS, Cadence AWR, HFSS, Sonnet, AXIEM) for linear, nonlinear, and electromagnetic analysis.
- Support laboratory validation, including S-parameters, output power, efficiency, load-pull, noise figure, and linearity measurements.
- Provide technical mentorship and guidance to junior designers and engineering teams.
- Collaborate with cross-functional teams (program management, mechanical engineering, manufacturing, sales, quality, and leadership) throughout the product development cycle.
- Assist in proposal efforts, system architecture studies, and internal R&D planning activities.
- Ensure timely project execution while contributing to continuous process improvements and the advancement of design best practices.
- Document design activities, development processes, and design reviews in accordance with company and industry standards.
Requirements
- BSEE with 18+ years or MSEE with 15+ years of experience in RF/MMIC design.
- Strong theoretical background in RF/microwave distributed-element circuits and transmission lines.
- Proven track record of successful MMIC product releases to production, preferably for high-frequency and/or high-power applications (X-band, K-band, Ka-band, mmWave preferred).
- Expertise in electromagnetic simulation techniques.
- Familiarity with small-signal and large-signal models of GaAs HEMTs and GaN-on-SiC HEMTs.
- Experience with PCB and hybrid module design, including MMIC and hybrid circuit integration.
- Proficient in design techniques such as nonlinear simulation, Cripps Analysis, and stability analysis using loop-gain methods.
- Strong understanding of load-pull contours and the use of load-pull data to optimize high-power amplifier designs.
- Expertise in MMIC power amplifier design, including: Nonlinear circuit design and simulation (harmonic balance, load-pull).
- Impedance matching techniques for high-power, high-PAE amplifiers.
- Thermal analysis and thermal management strategies.
- Advanced stability analysis techniques.
- Deep knowledge of GaAs pHEMT, GaN-on-SiC HEMT, or other advanced compound semiconductor technologies.
- Experience with advanced RF/microwave packaging technologies.
- Must be a U.S. Citizen with the ability to obtain and maintain a security clearance.
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard skills
RF designMMIC designhigh-power amplifierselectromagnetic simulationnonlinear simulationload-pull analysisimpedance matchingthermal analysisPCB designhybrid module design
Soft skills
technical mentorshipcollaborationproject executionprocess improvementdocumentation