Advanced Application Engineer – Automotive, German required

Solstice Advanced Materials

Advanced Application Engineer providing high-level technical support for automotive semiconductor customers in ADAS applications. Collaborating with cross-functional teams and enhancing customer relationships.

Posted 5/25/2026full-timeRemote • 🇷🇴 RomaniaMid-LevelSeniorWebsite

About the role

Key responsibilities & impact

Serve as the primary technical interface for automotive customers developing and integrating advanced semiconductor applications in ADAS systems.
Provide expert‑level troubleshooting for complex ADAS application, process, or reliability issues—including sensor fusion, thermal management, and system safety—across development and production phases.
Support customers during design reviews, process integration discussions, and root‑cause investigations for ADAS sensor modules, control units, and safety-critical electronics.
Act as a peer engineer to automotive customer technical teams, contributing proactive solutions and industry best practices for ADAS system performance and reliability.
Translate customer requirements into clear technical specifications, test plans, and application recommendations.
Support design‑in activities, including material selection, process window definition, and application validation.
Provide simulation inputs, characterization data, and application notes to accelerate customer confidence and adoption.
Help reduce re‑spins, late-stage changes, and re‑qualification cycles.

Requirements

What you’ll need

Bachelor’s degree in electrical engineering, Materials Science, Chemical Engineering, Thermal Engineering, Physics, or a related technical field.
Master’s degree is desirable but not required
German is required, ideally native German
Available to travel 50% /year
5 + years of experience in semiconductor applications engineering, technical support, process engineering, or reliability engineering.
Hands‑on experience working with IDMs, foundries, fabless companies, or Automotive OEMs or Tier 1
Strong familiarity with semiconductor manufacturing flows and cross‑company collaboration models.
Strong understanding of semiconductor devices, materials, packaging, or process integration
Experience with advanced packaging and integration concepts such as 2.5D/3D, chiplets, fan‑out, or system‑level considerations is a plus.
Ability to analyze and communicate complex technical data and failure mechanisms.
Comfortable working across development, qualification, and high‑volume manufacturing environments.
Strong engineer‑to‑engineer communication skills with the ability to build technical credibility.
Structured problem‑solving and root‑cause analysis mindset.
Ability to manage multiple customer programs in parallel with minimal supervision.
Comfortable presenting technical concepts to both deep technical and mixed technical/commercial audiences.

Benefits

Comp & perks

Willingness to travel (typically 20–40%) to customer sites, fabs, or OEM locations as required.
Hybrid work model depending on customer proximity and lab access needs.

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills & Tools

semiconductor applications engineeringsensor fusionthermal managementsystem safetyprocess engineeringreliability engineeringadvanced packaging2.5D/3D integrationchipletssystem-level considerations

Soft Skills

strong engineer-to-engineer communicationstructured problem-solvingroot-cause analysisability to manage multiple programspresentation skillstechnical credibilitycross-company collaborationcustomer supportproactive solutionsanalytical skills

Certifications

Bachelor's degree in electrical engineeringBachelor's degree in Materials ScienceBachelor's degree in Chemical EngineeringBachelor's degree in Thermal EngineeringBachelor's degree in Physics