Electromechanical Packaging Engineer

Red Cell Partners

Support chip scale packaging design and HDI organic substrate layout for integrated voltage regulator product line. ; Collaborate with substrate layout, ASIC design, and manufacturing engineers. 

Posted 6/30/2026Verified active Jul 25, 2026, 12:33 AMfull-timeTorrance • California • 🇺🇸 United States💰 $150,000 - $200,000 per yearWebsite

Core Competencies

Role fit

Core Competencies

Use this summary to align your resume positioning with the role.

Candidates should emphasize expertise in microelectronics packaging and PCB design, with a strong foundation in mechanical and electrical engineering principles. Proficiency in 3D mechanical CAD software and the ability to create mechanical drawings and electrical schematics are essential, along with a solid understanding of design for manufacturability and collaboration with cross-functional teams.

Highest-signal resume keywords

Microelectronics PackagingPCB Design3D Mechanical CAD SoftwareElectrical SchematicsDesign for Manufacturability (DFM)

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Microelectronics PackagingPCB Design3D Mechanical CAD SoftwareGD&TElectrical Schematics

Soft Skills

CollaborationWillingness to Learn

Tools & Technologies

CreoNXCatiaAltiumCadenceMentor

Certifications & Qualifications

BS in Mechanical EngineeringBS in Electrical EngineeringMS or Higher-Level Degree Preferred

Industry Keywords

Chip Scale PackagingHDI Organic Substrate LayoutFoundry ProcessesChip Scale Assembly ProcessesTape Out Processes

Tech Stack

Tools & technologies

Assembly

About the role

Key responsibilities & impact

Support chip scale packaging design and HDI organic substrate layout for integrated voltage regulator product line. 
Collaborate with substrate layout, ASIC design, and manufacturing engineers. 
Create mechanical drawings for substrate fabrication and packaged part assembly. Work with vendors for components, assembly, and test.

Requirements

What you’ll need

Minimum BS in Mechanical or Electrical engineering, MS or higher-level degree preferred.
5+ years’ experience with microelectronics packaging, and/or PCB design
Knowledge of foundry processes and chip scale assembly processes
Understanding of how electrical design requirements impact substrate layout and interconnect selection
Proficient with 3D mechanical CAD software (Creo, NX, Catia, etc.), generating mechanical drawings, and GD&T
Ability to read and create electrical schematics
Familiarity with tape out processes for wafers and substrate
Basic understanding of Form, Fit, Function elements in design for manufacturability (DFM).
willingness to learn new concepts and techniques and concepts
Familiarity with PCB design tools (Altium, Cadence, Mentor, etc.) is a plus

Benefits

Comp & perks

Career track opportunity with potential for rapid advancement with strong performance as the firm grows
100% employer paid, comprehensive health care including medical, dental, and vision for you and your family.
Paid maternity and paternity for 14 weeks at employees' normal pay.
Unlimited PTO, with management approval.
Opportunities for professional development and continued learning.
Optional 401K, FSA, and equity incentives available.
Salary Range: $150,000 – $200,000. This represents the typical salary range for this position based on experience, skills, and other factors.
Mental health benefits are available through Tara Mind.
Cost effective GLP-1 solutions available through Crux.
Managing and administering your application throughout the hiring process;