Quantum

Senior PIC Design Engineer

Quantum

full-time

Posted on:

Origin:  • 🇺🇸 United States

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Job Level

Senior

Tech Stack

Cyber SecurityRemote Sensing

About the role

  • Design, develop, and optimize integrated and packaged photonic devices oriented by market and internal quantum applications.
  • Design, simulate and optimize specific photonic components on TFLN platforms for customized and internal requirements.
  • Use industry-standard simulation tools (e.g., Lumerical, Tidy3D, Photonforge, HFSS) for design verification.
  • Pattern layout with our PDK, GDSfactory and Photonforge.
  • Optimize fabrication process flows in collaboration with foundry partners and/or in-house facilities.
  • Implement design-for-manufacturing (DFM) practices to improve yield and scalability.
  • Collaborate with the fabrication team to optimize the PDK for foundry and with the test team to analyze each fab run and iterate for the next run.
  • Drive PIC technology from concept through scalable manufacturing and ensure designs meet the demanding performance requirements of quantum applications.
  • Report to CTO and collaborate closely with fabrication, test and market teams.

Requirements

  • Ph.D. or master's degree in electrical engineering, Applied Physics, Photonics, or related field.
  • 5+ years of hands-on experience in PIC design and development, with at least 1 year in a senior role.
  • Proven track record of taking PIC designs from concept to fabricated prototypes and production.
  • Proficiency in simulation tools (e.g., Lumerical, Photonforge, Tidy3D, HFSS).
  • Strong knowledge of waveguide theory, coupling mechanisms, electrical and photonic device physics.
  • Experience working with semiconductor fabrication processes and foundry MPW programs.
  • Experience with pattern layout using PDK, GDSfactory and Photonforge.
  • Familiarity with design-for-manufacturing (DFM) practices, yield improvement, process control, and manufacturability optimization.
  • Experience in quantum photonic systems or related applications (preferred).
  • Familiarity with hybrid photonic/electronic routing, integration and advanced packaging (preferred).
  • Strong communication skills and ability to influence across teams.