Qorvo, Inc.

Design Engineering Intern

Qorvo, Inc.

internship

Posted on:

Location Type: Office

Location: OsakaJapan

Visit company website

Explore more

AI Apply
Apply

Job Level

Tech Stack

About the role

  • Producing and implementing designs to meet customer specifications for: Low cost and thermally efficient package platforms
  • LTE, carrier aggregation, multiple antennas, filters, and power management
  • Ruggedness, ESD, and quality
  • Meeting performance requirements while also considering size, cost, footprint, and schedule
  • Working with signal generators, spectrum analyzers, network analyzers, and power meters to compare simulated data to real lab data
  • Partnering with technicians to perform circuit simulations and testing as needed
  • Designing, testing, and tuning of RF PAs
  • Developing and executing test plans for electronics package mechanical robustness
  • Developing application guidelines for package assembly into next level assembly
  • Creating basic algorithms for automating FEA model generation

Requirements

  • Currently pursuing a BS, MS, PhD in Electrical or Mechanical Engineering
  • Minimum 3.0 GPA
  • RF circuit design course work and/or experience strongly preferred
  • Exposure to RF measurement equipment such as, spectrum analyzers and network analyzers preferred
  • Proficiency with Microsoft Office (Excel, Word, PowerPoint)
  • Software Exposure: ADS, FEM, HFSS, Momentum, Cadence, Dynamic Link, 3D CAD, Mechanical FEA
  • Self-Starter with strong written and verbal communication skills
  • Effective organization skills for systematic planning and scheduling
  • Detail oriented to ensure design and delivery of high yielding products
Benefits
  • Health insurance
  • 401(k) matching
  • Flexible working hours
  • Paid time off
  • Professional development opportunities
Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools
RF circuit designcircuit simulationstest plans developmentalgorithm creationmechanical robustness testingthermally efficient package designlow cost package platformspower managementcarrier aggregationmultiple antennas
Soft Skills
self-starterwritten communicationverbal communicationorganizational skillssystematic planningschedulingdetail oriented