Senior Engineer – Cu Hybrid Bonding
Qnity
full-time
Posted on:
Location Type: Hybrid
Location: Marlborough • Massachusetts • United States
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Job Level
About the role
- Drive end-to-end development of copper hybrid bonding processes for advanced packaging and 3D integration
- Define technical roadmap, milestones, and deliverables aligned with business objectives
- Collaborate with materials innovation and formulation teams to develop novel electroplated Cu for low temperature bonding processes
- Develop and optimize copper surface preparation, grain structure control, and bonding interface engineering to meet industry goals for CHB
- Implement advanced characterization techniques (e.g., EBSD, TEM, AFM) to analyze grain orientation and bonding quality
- Collaborate with global technology and commercial teams to promote technically differentiated Cu bonding technology
- Act as the primary technical interface with customers to align bonding technology with product requirements
- Partner with plating tool OEMs to evaluate, qualify, and optimize formulation for copper bonding and surface engineering
- Identify opportunities for process differentiation and file patents to protect intellectual property
- Stay ahead of industry trends and benchmark against leading-edge CHB technologies
Requirements
- Master’s degree in Materials Science, Chemistry, Chemical Engineering, Metallurgy, Electrical Engineering, or related field with a minimum of 4+ years relevant experience preferred
- Or Ph.D. in Materials Science, Chemistry, Chemical Engineering, Metallurgy, Electrical Engineering, or related field, with 1+ years relevant experience preferred
- Experience and knowledge in semiconductor packaging or interconnect technology development required
- Proven expertise in grain engineering, copper bonding, and hybrid bonding processes
- Hands-on experience with electrochemical deposition, CMP, and surface activation techniques
- Strong analytical and problem-solving skills
- Familiarity with reliability testing and failure analysis for bonded interfaces
Benefits
- Comprehensive pay and benefits package
- Equal opportunity employer
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills & Tools
copper hybrid bondingelectroplated Cucopper surface preparationgrain structure controlbonding interface engineeringadvanced characterization techniqueselectrochemical depositionCMPsurface activation techniquesreliability testing
Soft Skills
analytical skillsproblem-solving skillscollaborationcommunication
Certifications
Master’s degreePh.D.