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Lead Thermal Mechanical Engineer
Powerlattice IncLead Thermal Mechanical Engineer developing advanced thermal management solutions for semiconductor technologies. Collaborating with internal teams and customers to optimize high-performance chiplet solutions.
Posted 6/8/2026full-timeChandler • Arizona • 🇺🇸 United StatesSenior💰 $175,000 - $225,000 per yearWebsite
Tech Stack
Tools & technologiesAssembly
About the role
Key responsibilities & impact- Drive thermal-mechanical co-design across chiplet, package substrate, cold plate, heatsink, and system-level integration.
- Collaborate with package design teams to optimize stack-up, warpage, stiffness, CTE management, and assembly robustness.
- Evaluate emerging cooling technologies including direct-to-chip liquid cooling, embedded cooling, vapor chamber integration, and advanced TIM solutions.
- Perform detailed thermal and thermo-mechanical simulations using industry-standard tools.
- Define integration strategies enabling customer adoption of novel thermal solutions into final package assembly flows.
- Collaborate with OSATs, substrate suppliers, thermal solution vendors, and manufacturing partners to enable scalable deployment.
Requirements
What you’ll need- MS or PhD in Mechanical Engineering, Thermal Engineering, Materials Science, or related field
- 10+ years of experience in semiconductor thermal engineering, advanced packaging, or high-performance computing systems
- Experience with thermal and thermo-mechanical simulation tools such as ANSYS, Icepak, COMSOL, Abaqus, or equivalent
- Experience developing thermal solutions for high-power semiconductor devices or advanced packaging applications
- Strong understanding of reliability physics including warpage, CTE mismatch, TIM performance, and thermal cycling
- Knowledge of package assembly processes, substrate manufacturing, and OSAT workflows
Benefits
Comp & perks- Stock option grant
- Comprehensive benefits package including health, dental, vision, and 401(k)
ATS Keywords
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Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills & Tools
thermal engineeringthermo-mechanical simulationsthermal solutions developmentreliability physicsCTE managementthermal cyclingpackage assembly processessubstrate manufacturingadvanced packaginghigh-performance computing systems
Certifications
MS in Mechanical EngineeringPhD in Mechanical EngineeringMS in Thermal EngineeringPhD in Thermal EngineeringMS in Materials SciencePhD in Materials Science