Apply

Ready to go for it?

AI Apply speeds things up—apply directly if you prefer.

FREE ACCESS
5,000–10,000 jobs/day
JobTailor Logo

See all jobs on JobTailor

Search thousands of fresh jobs every day.

Discover
  • Fresh listings
  • Fast filters
  • No subscription required
Create a free account and start exploring right away.
Powerlattice Inc

Lead Thermal Mechanical Engineer

Powerlattice Inc

Lead Thermal Mechanical Engineer developing advanced thermal management solutions for semiconductor technologies. Collaborating with internal teams and customers to optimize high-performance chiplet solutions.

Posted 6/8/2026full-timeChandler • Arizona • 🇺🇸 United StatesSenior💰 $175,000 - $225,000 per yearWebsite

Tech Stack

Tools & technologies
Assembly

About the role

Key responsibilities & impact
  • Drive thermal-mechanical co-design across chiplet, package substrate, cold plate, heatsink, and system-level integration.
  • Collaborate with package design teams to optimize stack-up, warpage, stiffness, CTE management, and assembly robustness.
  • Evaluate emerging cooling technologies including direct-to-chip liquid cooling, embedded cooling, vapor chamber integration, and advanced TIM solutions.
  • Perform detailed thermal and thermo-mechanical simulations using industry-standard tools.
  • Define integration strategies enabling customer adoption of novel thermal solutions into final package assembly flows.
  • Collaborate with OSATs, substrate suppliers, thermal solution vendors, and manufacturing partners to enable scalable deployment.

Requirements

What you’ll need
  • MS or PhD in Mechanical Engineering, Thermal Engineering, Materials Science, or related field
  • 10+ years of experience in semiconductor thermal engineering, advanced packaging, or high-performance computing systems
  • Experience with thermal and thermo-mechanical simulation tools such as ANSYS, Icepak, COMSOL, Abaqus, or equivalent
  • Experience developing thermal solutions for high-power semiconductor devices or advanced packaging applications
  • Strong understanding of reliability physics including warpage, CTE mismatch, TIM performance, and thermal cycling
  • Knowledge of package assembly processes, substrate manufacturing, and OSAT workflows

Benefits

Comp & perks
  • Stock option grant
  • Comprehensive benefits package including health, dental, vision, and 401(k)

ATS Keywords

✓ Tailor your resume
Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools
thermal engineeringthermo-mechanical simulationsthermal solutions developmentreliability physicsCTE managementthermal cyclingpackage assembly processessubstrate manufacturingadvanced packaginghigh-performance computing systems
Certifications
MS in Mechanical EngineeringPhD in Mechanical EngineeringMS in Thermal EngineeringPhD in Thermal EngineeringMS in Materials SciencePhD in Materials Science