Advanced Packaging Reliability Engineer

OpenAI

Package Reliability Engineer leading reliability assessments and optimizations for HPC packages at OpenAI. Collaborating with cross-functional teams to enhance package performance and robustness.

Posted 6/17/2026full-timeSan Francisco • California • 🇺🇸 United StatesSeniorLead💰 $266,000 - $445,000 per yearWebsite

Tech Stack

Tools & technologies

AssemblyElectronRay

About the role

Key responsibilities & impact

Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development.
Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability.
Develop, validate, and apply package reliability models and lifetime-prediction methodologies for assembly, qualification, and product operating conditions.
Evaluate and recommend package architectures, structural designs, materials, and assembly processes to maximize reliability performance and manufacturing robustness.
Predict electromigration lifetime of package interconnects under product-specific current, temperature, workload, duty-cycle, and PCB boundary conditions.

Requirements

What you’ll need

8+ years of industry experience & knowledge of semiconductor package reliability principles and failure mechanisms, including electromigration, solder-joint fatigue, interfacial delamination, dielectric cracking, via failure, warpage, creep, stress relaxation, and material degradation.
In-depth knowledge of advanced packaging architectures, including 2.5D and 3.5D integration, interposers, embedded bridges, chiplets, large package substrates, HBM integration, redistribution layers, and package-level power delivery.
Demonstrated experience leading package failure investigations, performing root-cause analysis, and implementing effective design, material, process, or manufacturing corrective actions.
Strong experience with thermal and mechanical finite-element modeling of packages, including temperature distribution, warpage, stress, strain, fatigue, and interfacial reliability.
Strong understanding of package-material behavior, including coefficient of thermal expansion, elasticity, viscoelasticity, plasticity, creep, adhesion, fracture toughness, thermal conductivity, and temperature-dependent properties.
Experience developing electromigration or interconnect lifetime models for solder joints, vias, redistribution layers, interposers, or package power-delivery structures.
Knowledge of package qualification methods, acceleration models, thermal cycling, power cycling, current-stress testing, and reliability lifetime extrapolation.
Familiarity with package failure-analysis techniques such as acoustic microscopy, X-ray imaging, cross-sectioning, scanning electron microscopy, and material characterization.
Experience supporting package-integrated voltage regulation, high-current power delivery, or high-transient-current AI and HPC products.
MS or PhD in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or a related technical field.
Strong communication, cross-functional collaboration, and technical leadership skills.

Benefits

Comp & perks

Medical, dental, and vision insurance for you and your family, with employer contributions to Health Savings Accounts
Pre-tax accounts for Health FSA, Dependent Care FSA, and commuter expenses (parking and transit)
401(k) retirement plan with employer match
Paid parental leave (up to 24 weeks for birth parents and 20 weeks for non-birthing parents), plus paid medical and caregiver leave (up to 8 weeks)
Paid time off: flexible PTO for exempt employees and up to 15 days annually for non-exempt employees
13+ paid company holidays, and multiple paid coordinated company office closures throughout the year for focus and recharge, plus paid sick or safe time (1 hour per 30 hours worked, or more, as required by applicable state or local law)
Mental health and wellness support
Employer-paid basic life and disability coverage
Annual learning and development stipend to fuel your professional growth
Daily meals in our offices, and meal delivery credits as eligible
Relocation support for eligible employees
Additional taxable fringe benefits, such as charitable donation matching and wellness stipends, may also be provided.

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Hard Skills & Tools

reliability test planningrisk identificationfailure-mechanism analysisroot-cause investigationthermo-mechanical modelingpackage reliability modelslifetime-prediction methodologiesthermal and mechanical finite-element modelingelectromigration lifetime modelingpackage qualification methods

Soft Skills

strong communicationcross-functional collaborationtechnical leadership

Certifications

MS in Mechanical EngineeringMS in Electrical EngineeringMS in Materials ScienceMS in PhysicsPhD in Mechanical EngineeringPhD in Electrical EngineeringPhD in Materials SciencePhD in Physics