Advanced Packaging Multi-Physics Modeling Engineer

OpenAI

. Lead multi-physics modeling and simulation across thermal, mechanical, and electrical domains for next-generation AI/HPC advanced packaging systems.

Posted 5/7/2026full-timeSan Francisco • California • 🇺🇸 United StatesMid-LevelSenior💰 $342,000 - $445,000 per yearWebsite

About the role

Key responsibilities & impact

Lead multi-physics modeling and simulation across thermal, mechanical, and electrical domains for next-generation AI/HPC advanced packaging systems.
Drive co-optimization of chip, package, and system interactions to improve power integrity, thermal performance, mechanical reliability, and overall package scalability.
Develop and validate electro-thermal-mechanical simulation methodologies for heterogeneous integration platforms including 2.5D/3D packaging, HBM integration, and chiplet architectures.
Perform reliability assessment and root-cause analysis for package warpage, stress, underfill interaction, solder fatigue, electromigration, and thermo-mechanical failures.
Correlate simulation results with silicon, hardware measurements, and reliability test data to improve modeling accuracy and design predictability.

Requirements

What you’ll need

Strong experience in thermal and mechanical modeling for advanced packaging systems.
Solid understanding of electro-thermal interactions and temperature-dependent electrical behavior.
Experience solving complex chip/package/system integration challenges using multi-physics simulation and first-principles engineering approaches.
Hands-on experience with finite element analysis (FEA) and multi-physics simulation tools such as ANSYS, COMSOL, Abaqus, Icepak, or equivalent.
Knowledge of package reliability mechanisms including warpage, solder fatigue, underfill stress, electromigration (EM), and thermo-mechanical interactions.
MS or PhD in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or a related technical field.
Strong communication, cross-functional collaboration, and technical leadership skills.

Benefits

Comp & perks

Medical, dental, and vision insurance for you and your family, with employer contributions to Health Savings Accounts
Pre-tax accounts for Health FSA, Dependent Care FSA, and commuter expenses (parking and transit)
401(k) retirement plan with employer match
Paid parental leave (up to 24 weeks for birth parents and 20 weeks for non-birthing parents), plus paid medical and caregiver leave (up to 8 weeks)
Paid time off: flexible PTO for exempt employees and up to 15 days annually for non-exempt employees
13+ paid company holidays, and multiple paid coordinated company office closures throughout the year for focus and recharge, plus paid sick or safe time (1 hour per 30 hours worked, or more, as required by applicable state or local law)
Mental health and wellness support
Employer-paid basic life and disability coverage
Annual learning and development stipend to fuel your professional growth
Daily meals in our offices, and meal delivery credits as eligible
Relocation support for eligible employees
Additional taxable fringe benefits, such as charitable donation matching and wellness stipends, may also be provided.

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills & Tools

multi-physics modelingthermal modelingmechanical modelingelectro-thermal interactionsfinite element analysismulti-physics simulationfirst-principles engineeringreliability assessmentroot-cause analysismodeling accuracy

Soft Skills

communicationcross-functional collaborationtechnical leadership

Certifications

MS in Mechanical EngineeringMS in Electrical EngineeringMS in Materials ScienceMS in PhysicsPhD in Mechanical EngineeringPhD in Electrical EngineeringPhD in Materials SciencePhD in Physics