NVIDIA

Senior Package Layout Engineer – Hardware

NVIDIA

full-time

Posted on:

Location Type: Hybrid

Location: Santa Clara • Arizona • California • United States

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Salary

💰 $136,000 - $258,750 per year

Job Level

Senior

About the role

  • Collaborate with Technical Package Lead and different design teams
  • Implement high speed/density ASIC packages
  • Perform substrate breakout patterns for ASIC packages
  • Optimize package pinout incorporating system level trade-offs of pins assignment
  • Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite
  • Propose layout design trade-offs to the Technical Package Lead for resolution and implementation
  • Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance
  • Develop symbols and CAD library databases using Cadence APD design tools
  • Develop methodologies to improve layout productivity

Requirements

  • Hold a B.S. Electrical Engineering or equivalent experience
  • 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology.
  • Experience with HDI designs is a plus
  • Proven experience in substrate layout of wire bond and flip chip packages, preferred
  • Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
  • Solid understanding of high-speed design signal integrity practices
  • Experience with Virtuoso and Calibre is a plus
  • Experience using Valor is helpful
Benefits
  • Equity
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Applicant Tracking System Keywords

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Hard Skills & Tools
ASIC package designsubstrate breakout patternspackage routingpackage placementlayout designhigh-speed designsignal integrityHDI designwire bond packagesflip chip packages
Soft Skills
collaborationproblem-solvingcommunicationdesign feasibility analysismethodology development
Certifications
B.S. Electrical Engineering