NVIDIA

Senior Package Layout Engineer, Hardware

NVIDIA

full-time

Posted on:

Origin:  • 🇺🇸 United States • California

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Salary

💰 $132,000 - $253,000 per year

Job Level

Senior

About the role

  • Collaborate to implement high speed/density ASIC packages as part of a Layout team.
  • Perform substrate breakout patterns for ASIC packages.
  • Optimize package pinout incorporating system level trade-offs of pins assignment.
  • Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.
  • Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.
  • Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.
  • Develop symbols and CAD library databases using Cadence APD design tools
  • Develop methodologies to improve layout productivity
  • Work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues.

Requirements

  • Hold a B.S. Electrical Engineering or equivalent experience
  • 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology.
  • Experience with HDI designs is a plus
  • Proven experience in substrate layout of wire bond and flip chip packages, preferred
  • Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
  • Solid understanding of high-speed design signal integrity practices
  • Experience with Virtuoso and Calibre is a plus
  • Experience using Valor is helpful
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