Salary
💰 $132,000 - $253,000 per year
About the role
- Collaborate to implement high speed/density ASIC packages as part of a Layout team.
- Perform substrate breakout patterns for ASIC packages.
- Optimize package pinout incorporating system level trade-offs of pins assignment.
- Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.
- Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.
- Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.
- Develop symbols and CAD library databases using Cadence APD design tools
- Develop methodologies to improve layout productivity
- Work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues.
Requirements
- Hold a B.S. Electrical Engineering or equivalent experience
- 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology.
- Experience with HDI designs is a plus
- Proven experience in substrate layout of wire bond and flip chip packages, preferred
- Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
- Solid understanding of high-speed design signal integrity practices
- Experience with Virtuoso and Calibre is a plus
- Experience using Valor is helpful