Senior Packaging Development Engineer

Nokia

Packaging Development Engineer at Nokia leading the design and development of next-generation optical package solutions. Collaborating with cross-functional teams to optimize electrical assembly and ensure mass production.

Posted 5/20/2026full-timeSunnyvale • California • 🇺🇸 United StatesSenior💰 $159,782 - $296,739 per yearWebsite

Tech Stack

Tools & technologies

Assembly

About the role

Key responsibilities & impact

Lead next generation Silicon Photonics package design in collaboration with cross-functional teams, stakeholders and vendors to ensure package requirements are met.
Own all the development of all the advanced packaging activities and designs: flip chip, reflow, fanout, thermo-compression bonding, underfill, hot bar soldering, wirebonding, etc…
Optimize the assembly of electrical and optical engines and apply Design for Manufacturing principles to meet production volumes and cost targets.
Survey advanced SiPh packaging solutions, materials and vendors to stay current with new technological advancements.
Own and maintain the process and the manufacturing documentation, along with Bill of Materials for new products.
Drive package debug activities during product validation and qualification.
Support the development activities at our Contract Manufacturers, both remotely and on-site to ensure a smooth transition to mass production.

Requirements

What you’ll need

5-8 years of experience in high-speed electronics and Silicon Photonics package design.
Experience with flip chip, fanout, thermo-compression bonding, underfill, hot bar soldering, wirebonding, die attach.
Experience in microelectronics, optoelectronics packaging design and assembly.
Knowledgeable in packaging technologies and processes, with glass/ceramic/metal material properties and multilayer materials interfaces after bonding.
Experience in high-volume packaging of optical transceivers, co-packaged optics, multi-chips module, pluggables, 2.5/ 3D packages.
Experience with documentation of fabrication, inspection, and assembly processes.
Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience.

Benefits

Comp & perks

Corporate Retirement Savings Plan
Health and dental benefits
Short-term disability, and long-term disability
Life insurance, and AD&D – Company paid 2x base pay
Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
Paid time off for holidays and Vacation
Employee Stock Purchase Plan
Tuition Assistance Plan
Adoption assistance
Employee Assistance Program/Work Life Resource Program

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills & Tools

Silicon Photonics package designflip chipfanoutthermo-compression bondingunderfillhot bar solderingwirebondingdie attachmicroelectronics packagingoptoelectronics packaging

Soft Skills

collaborationleadershipcommunicationproblem-solvingorganizational skills