Senior Signal Processing Engineer
Leidos
LinuxPythonTypeScript
Packaging Development Engineer
Nokia
full-time
Posted on:
Location Type: Hybrid
Location: Sunnyvale • California • 🇺🇸 United States
Visit company websiteJob Level
Mid-LevelSenior
Tech Stack
Assembly
About the role
- Lead next generation Silicon Photonics package design in collaboration with cross-functional teams, stakeholders and vendors to ensure package requirements are met.
- Own all the development of all the advanced packaging activities and designs: flip chip, reflow, fanout, thermo compression bonding, underfill, hot bar soldering, etc…
- Optimize the assembly of electrical engines and apply Design for Manufacturing principles to meet production volumes and cost targets.
- Survey advanced SiPh packaging solutions, materials and vendors to stay current with new technological advancements.
- Own and maintain the process and the manufacturing documentation, along with Bill of Materials for new products.
- Drive package debug activities during product validation and qualification.
- Support the development activities at our Contract Manufacturers, both remotely and on-site to ensure a smooth transition to mass production.
Requirements
- 4 -5 years of experience. Experience in high-speed electronics and Silicon Photnics package design.
- Experience with flip chip, fanout, thermo compression bonding, underfill, hot bar soldering. Experience in microelectronics, optoelectronics packaging design and assembly.
- Knowledgeable in packaging technologies and processes, with glass/ceramic/metal material properties and multilayer materials interfaces after bonding.
- Experience with documentation of fabrication, inspection, and assembly processes.
- Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
- Experience with package and process design/development from design to production.
- Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience.
Benefits
- Corporate Retirement Savings Plan
- Health and dental benefits
- Short-term disability, and long-term disability
- Life insurance, and AD&D – Company paid 2x base pay
- Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
- Paid time off for holidays and Vacation
- Employee Stock Purchase Plan
- Tuition Assistance Plan
- Adoption assistance
- Employee Assistance Program/Work Life Resource Program
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard skills
Silicon Photonics package designflip chipfanoutthermo compression bondingunderfillhot bar solderingDesign for Manufacturingmetrology techniquesSEMconfocal microscopy
Soft skills
interpersonal skillscommunication skillsproblem-solving skills
