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Principal Manufacturing Engineer, Subcon, Backend – Assembly
NexperiaPrincipal Manufacturing Engineer acting as technical interface between Nexperia and subcontractors in semiconductor assembly operations. Ensuring quality and cost efficiency through technical alignment and issue resolution.
ATS Keywords
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Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills
semiconductor assemblywafer level manufacturingbackend manufacturingsemiconductor packaging processesmanufacturing flowsproject managementprocess risk assessmentscost reductionvalue engineeringquality assurance
Soft Skills
analytical skillsproblem-solving skillscommunication skillsstakeholder managementleadershiporganizational skills
Certifications & Qualifications
Bachelor’s degree in Electrical EngineeringBachelor’s degree in Electronics EngineeringBachelor’s degree in Mechanical Engineering
Industry Keywords
NPI (New Product Introduction)auditsquality KPIsVDA compliancehigh-volume productionhigh-mix production
Tech Stack
Tools & technologiesAssembly
About the role
Key responsibilities & impact- Act as technical interface between Nexperia and external subcontractor manufacturing sites (assembly / backend production)
- Review and approve process or material changes introduced by subcontractors (first-level technical gatekeeper)
- Support process risk assessments and ensure manufacturing changes meet quality and reliability requirements
- Drive resolution of production issues, yield problems, and quality deviations at subcontractor sites
- Monitor and manage subcontractor performance, including operational and quality KPIs
- Support NPI (New Product Introduction) and industrialization of new packages/processes at subcontractors
- Lead or support cost reduction and value engineering initiatives
- Participate in audits (customer, quality, VDA) and support compliance verification activities
- Support project milestones, technical reviews, and subcontractor performance reporting
Requirements
What you’ll need- Bachelor’s degree in Electrical, Electronics, Mechanical Engineering, or related field
- 10+ years of experience in semiconductor assembly / wafer level / backend manufacturing
- Strong experience in high-volume and high-mix production environments
- Good understanding of semiconductor packaging processes and manufacturing flows
- Project management experience in engineering or manufacturing environments
- Strong analytical and problem-solving skills
- Good communication and stakeholder management skills
Benefits
Comp & perks- Employee resource groups such as the Pride Network Group or global and local Women's groups