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Senior Manager, Die Bond Product Engineering
NexperiaDie Bond Product Engineering Manager at ITEC driving next-gen die attach technology for semiconductor applications. Leading teams to deliver high-performance solutions in real customer applications.
ATS Keywords
Tailor your resumeApplicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills
die attach developmentNPI rampstructured data analysisroot cause analysisproduct managementhigh-volume manufacturingyield improvementreliability engineeringautomationproblem-solving
Soft Skills
leadershipmentoringteam buildingstrategic decision-makingcommunicationcultural awarenesscollaborationtechnical authorityescalation managementcooperative efforts
Certifications & Qualifications
Bachelor degree in EngineeringMaster degree in Engineering
Industry Keywords
semiconductor backendhigh precision equipment manufacturingproduct engineeringmass productionpackaging segmentsapplication benchmarkstool capabilityscalable solutionstotal cost of ownershipdie bonder products
About the role
Key responsibilities & impact- Own the process application and performance of the die bonder product portfolio across key packaging segments
- Define product requirements, use-case scenarios, and application benchmarks for new platforms or modules
- Lead die attach development, qualification, and NPI ramp to high-volume manufacturing
- Drive yield, reliability, and downtime reduction through structured data analysis and root cause analysis
- Set technical direction for die bond equipment strategy, automation, and future technologies
- Act as senior escalation point and technical authority for complex product and customer issues
- Lead, mentor, and develop a team of product and application engineers with strong competence in die attach applications, tool capability, and problem-solving
- Partner with R&D, Manufacturing, Quality, and Supply Chain to deliver robust, scalable solutions
- Ensure die bonder products remain competitive in performance, flexibility, reliability, and total cost of ownership
Requirements
What you’ll need- Bachelor or Master degree in Engineering or related discipline
- 10yrs+ experience in Semiconductor backend or high precision equipment manufacturing
- Advanced disciplinary knowledge and expertise in product management
- Proven leadership in product engineering, NPI, and mass production environments
- Able to balance technical depth with strategic decision-making and people leadership
- Team builder and player, with strong cultural awareness
- Sound skill in leading cooperative efforts across different teams to deliver results
- Good communication skills
- Able to speak Mandarin and/or Cantonese will be a plus.
Benefits
Comp & perks- Health insurance
- Professional development opportunities