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Senior Manager, Die Bond Product Engineering
NexperiaDie Bond Product Engineering Manager at ITEC driving next-gen die attach technology for semiconductor applications. Leading teams to deliver high-performance solutions in real customer applications.
About the role
Key responsibilities & impact- Own the process application and performance of the die bonder product portfolio across key packaging segments
- Define product requirements, use-case scenarios, and application benchmarks for new platforms or modules
- Lead die attach development, qualification, and NPI ramp to high-volume manufacturing
- Drive yield, reliability, and downtime reduction through structured data analysis and root cause analysis
- Set technical direction for die bond equipment strategy, automation, and future technologies
- Act as senior escalation point and technical authority for complex product and customer issues
- Lead, mentor, and develop a team of product and application engineers with strong competence in die attach applications, tool capability, and problem-solving
- Partner with R&D, Manufacturing, Quality, and Supply Chain to deliver robust, scalable solutions
- Ensure die bonder products remain competitive in performance, flexibility, reliability, and total cost of ownership
Requirements
What you’ll need- Bachelor or Master degree in Engineering or related discipline
- 10yrs+ experience in Semiconductor backend or high precision equipment manufacturing
- Advanced disciplinary knowledge and expertise in product management
- Proven leadership in product engineering, NPI, and mass production environments
- Able to balance technical depth with strategic decision-making and people leadership
- Team builder and player, with strong cultural awareness
- Sound skill in leading cooperative efforts across different teams to deliver results
- Good communication skills
- Able to speak Mandarin and/or Cantonese will be a plus.
Benefits
Comp & perks- Health insurance
- Professional development opportunities
ATS Keywords
✓ Tailor your resumeApplicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills & Tools
die attach developmentNPI rampstructured data analysisroot cause analysisproduct managementhigh-volume manufacturingyield improvementreliability engineeringautomationproblem-solving
Soft Skills
leadershipmentoringteam buildingstrategic decision-makingcommunicationcultural awarenesscollaborationtechnical authorityescalation managementcooperative efforts
Certifications
Bachelor degree in EngineeringMaster degree in Engineering