Murata

Staff Engineer, Manufacturing Test

Murata

full-time

Posted on:

Location Type: Office

Location: Taiwan

Visit company website

Explore more

AI Apply
Apply

Job Level

Tech Stack

About the role

  • Owns the manufacturing test strategy and standards for RF semiconductor devices, from NPI through high-volume manufacturing and governs cross-site deployment at internal and OSAT facilities to deliver measurable improvements in yield, DPPM, test time, and cost-of-test.
  • Define and govern test architecture, qualification criteria, and release standards for ATE, probers/handlers, and fixtures; lead cross site correlation and signoff for production release.
  • Own the OSAT engagement model (release gates, audit readiness) and drive adoption of standardized test flows and data pipelines across all partner sites.
  • Act as technical escalation owner for high severity production incidents; lead structured problem solving (DOE/SPC/8D) and institutionalize corrective standards to prevent recurrence.
  • Lead cross functional teams (Design/DFT, Product, Quality, Reliability, Ops) to eliminate systemic yield limiters and optimize guard banding/coverage with quantified risk tradeoffs.
  • Drive projects, programs, and company initiatives from planning through tactical execution.
  • Codify and deploy continuous improvement standards (e.g., test debug procedures, hardware design best practices, standardized test methodologies) and mentor engineers in their application.
  • Influence ATE vendor roadmaps (e.g., instrumentation, multisite, RF capabilities) and partner with Design/DFT to set DFT for manufacturability requirements and release criteria.

Requirements

  • 8-12 years of Semiconductor Test/Product/Manufacturing Engineering experience
  • Demonstrated ownership of NPItoHVM ramps across multiple sites/OSATs, delivering ≥20% test time reduction and measurable DPPM/yield improvements.
  • Expert on NI STS, Advantest V93000 and/or Teradyne UltraFLEX (or equivalent) including program development, correlation, guard banding, and PVT characterization.
  • Strong RF test depth (EVM, ACPR, NF, linearity; Sparam/Smith chart, impedance match), test hardware (load boards, contactors, probe cards), and automation (Python/C/C++/LabVIEW; PXI/GPIB).
  • Leadership: mentoring engineers; leading cross functional initiatives; authoring standards adopted org-wide.
Benefits
  • pSemi Corporation supports a diverse workforce and is committed to a policy of equal employment opportunity for applicants and employees.
  • pSemi does not discriminate on the basis of age, race, color, religion (including religious dress and grooming practices), sex/gender (including pregnancy, childbirth, or related medical conditions or breastfeeding), gender identity, gender expression, genetic information, national origin (including language use restrictions and possession of a driver’s license issued under Vehicle Code section 12801.9), ancestry, physical or mental disability, legally-protected medical condition, military or veteran status (including “protected veterans” under applicable affirmative action laws), marital status, sexual orientation, or any other basis protected by local, state or federal laws applicable to the Company.
Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools
RF semiconductor devicesmanufacturing test strategytest architecturequalification criteriatest methodologiescontinuous improvement standardsprogram developmentautomationguard bandingPVT characterization
Soft Skills
leadershipmentoringstructured problem solvingcross functional collaborationinfluencingdriving projectstactical executioncommunication