Senior Engineer – Advanced Packaging SI/PI

Marvell Technology

Senior Engineer supporting advanced packaging and signal integrity solutions at Marvell. Collaborating with teams for optimization and innovation in semiconductor packaging technologies.

Posted 7/27/2026full-timeWestborough • Massachusetts, Vermont • 🇺🇸 United StatesSeniorWebsite

Core Competencies

Role fit

Core Competencies

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Demonstrates expertise in Signal Integrity and Power Delivery concepts, with proficiency in simulation and analysis tools such as Ansys HFSS and Keysight ADS. Capable of automating simulation workflows and collaborating effectively with cross-functional teams to optimize electrical performance in packaging design.

Highest-signal resume keywords

Signal Integrity AnalysisPower Delivery VerificationAnsys HFSSKeysight ADSScripting for Automation

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Signal IntegrityPower DeliverySimulation TechniquesCircuit ExtractionData ProcessingEDA Tool Development2D/2.5D/3D Package DesignWiring StudiesPost-ProcessingElectrical Performance Optimization

Soft Skills

Strong CommunicationDocumentation Skills

Tools & Technologies

Cadence SigrityPCAD Software

Industry Keywords

Semiconductor PackagingPCB DesignTechnical DegreeElectrical EngineeringComputer Engineering

About the role

Key responsibilities & impact

Support SI/PI analysis and optimization for 2D/2.5D/3D package designs
Run simulation tasks for signal and power integrity sign-off
Write scripts to automate simulation setup, data extraction, and post-processing for SI/PI analysis workflows
Work with physical designers and IP teams to optimize electrical performance
Contribute to wiring studies for signal routing, power delivery verification, and package size decisions
Support the PCAD software team on EDA tooling projects as capacity allows, contributing to internal tool development for packaging design workflows
Document analysis results and present findings to internal teams
Participate in cross-functional meetings and design reviews

Requirements

What you’ll need

BS degree in a technical field (Electrical Engineering, Computer Engineering, or related) with coursework or hands-on exposure to signal integrity and power delivery concepts with 3+ years of relatable experience OR MS degree in a technical field (Electrical Engineering, Computer Engineering, or related) with coursework or hands-on exposure to signal integrity and power delivery concepts
Experience with simulation and analysis tools such as Ansys HFSS, Keysight ADS, or Cadence Sigrity
Working knowledge of circuit extraction and simulation techniques
Scripting ability for simulation automation and data processing
Familiarity with semiconductor packaging technologies, substrate, or PCB design
Strong communication and documentation skills
Interest in growing into package and PCB electrical design work.

Benefits

Comp & perks

employee stock purchase plan with a 2-year look back
family support programs to help balance work and home life
robust mental health resources to prioritize emotional well-being
recognition and service awards to celebrate contributions and milestones